Heated Oscillator Package Layout for Frequency Stability
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Solution Overview
Problem
Existing oscillators face challenges in maintaining the temperature stability of resonator elements due to heat transfer from the outside environment, affecting the characteristics of oscillation signals.
Innovation Solution
An oscillator design featuring an outer package with a housing space, an inner package, a resonator element, a heater element, and bonding wires that electrically couple the heater element to both the inner and outer packages, while using heat-insulating members to minimize external heat transfer and maintain a reduced-pressure environment for efficient temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If through holes are provided in the spacer for heat transfer, then heat dissipation from the heater package is improved, but external heat is transferred to the heater package or TCXO package via the through holes, affecting oscillation signal characteristics
Solution Approach 1:
The heat dissipation function is segmented from the electrical connection function. Instead of using through holes that serve both purposes, the invention uses separate bonding wires for electrical connection and a dedicated heat dissipation structure (heat dissipation fins or heat dissipation holes in the base substrate) for thermal management. This segmentation allows heat dissipation without creating direct thermal pathways from the external environment.
Solution Approach 2:
The harmful thermal conduction pathway through the spacer is extracted and removed. The invention eliminates the through holes in the spacer that created the thermal bridge, and instead implements heat dissipation through the base substrate structure itself, which does not create a direct thermal pathway from the external environment to the heater package or TCXO package.
2Ease of manufacture
If the heater package is mounted on the base substrate via a spacer, then assembly is simplified, but heat from the outside of the base substrate is transferred to the heater package or TCXO package
Solution Approach 1:
The harmful thermal conduction pathway through the spacer is extracted and removed. The invention eliminates the through holes in the spacer that created the thermal bridge, and instead implements heat dissipation through the base substrate structure itself, which does not create a direct thermal pathway from the external environment to the heater package or TCXO package.
Solution Approach 2:
The base substrate serves as an intermediary heat dissipation medium. Instead of relying on the spacer for heat dissipation (which created thermal pathways), the invention uses the base substrate as the primary heat dissipation structure through fins or holes, mediating the thermal management without creating direct thermal bridges to external heat sources.
3Reliability
If bonding wires are used to electrically couple the heater element to the outer package, then electrical connection is achieved, but heat transfer paths are created
Solution Approach 1:
The electrical connection function and thermal management function are segmented. Bonding wires are used exclusively for electrical coupling with minimal thermal impact, while a separate heat dissipation structure (fins or base substrate holes) handles thermal management. This segmentation allows each function to be optimized independently.
Solution Approach 2:
The thermal parameters of the bonding wires are optimized by using materials and configurations that minimize thermal conduction while maintaining electrical conductivity. The invention carefully controls the parameters of the bonding wires (material, diameter, length, configuration) to reduce their thermal impact while achieving reliable electrical coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses frequency fluctuations by maintaining the resonator element at a desired temperature, reducing external heat influence and enhancing oscillation characteristics.
Implementation Method 1
a heater element housed in the housing space and fixed to the inner package
Implementation Method 2
at least one first bonding wire configured to couple the heater element and the outer package to each other, and configured to electrically couple the conducting member and the outer package to each other
Data Source
AI summary
There is configured an oscillator characterized by including an outer package having a housing space, an inner package housed in the housing space, a resonator element housed in the inner package, a heater element housed in the housing space, and fixed to the inner package, an oscillation circuit configured to oscillate the resonator element, a conducting member configured to electrically couple the inner package and the heater element to each other, and a first bonding wire configured to couple the heater element and the outer package to each other, and configured to electrically couple the conducting member and the outer package to each other.