Heated Pin Interconnects for BGA Coupling Without Retention Load
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Solution Overview
Problem
Legacy land grid array (LGA) technology faces limitations in scalability due to increased retention load with higher pin counts, leading to space constraints in server chassis and insufficient power delivery and signal integrity for modern CPU needs.
Innovation Solution
The use of a substrate with embedded trace heaters and pins that heat solder elements to form a secure physical and electrical joint with ball grid array (BGA) packages, allowing for easy attachment and detachment, reducing the need for retention load hardware and improving signal integrity and power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If legacy LGA technology is used with increased pin counts, then power delivery and signal integrity are improved, but retention load increases leading to space constraints in server chassis
Solution Approach 1:
The patent replaces the mechanical retention load system of LGA with a thermal bonding system using heated pins that form permanent solder joints. This eliminates the need for retention hardware while maintaining secure electrical connections, thereby improving power delivery without increasing space requirements in the server chassis.
Solution Approach 2:
The invention changes the connection state from mechanical (LGA) to thermal-bonded (solder joints). By controlling temperature parameters during assembly, the pins form permanent solder joints that provide superior power delivery and signal integrity without requiring retention mechanisms, thus resolving the space constraint issue.
2Power
If legacy LGA technology is used with increased pin counts, then power delivery is improved, but device complexity increases due to retention load hardware
Solution Approach 1:
The patent replaces the complex mechanical retention load system with a simple thermal bonding process. The heated pins create permanent solder joints that inherently provide both mechanical retention and electrical connection, eliminating the need for separate retention hardware and reducing overall device complexity while maintaining power delivery capabilities.
Solution Approach 2:
The invention merges the retention function and electrical connection function into a single integrated solution. The heated pins simultaneously provide mechanical support, electrical connection, and retention through the solder joint, eliminating the need for separate retention hardware and simplifying the overall device structure.
3Reliability
If heated pins are used to couple with BGA, then signal integrity is improved, but manufacturing complexity increases due to heating requirements
Solution Approach 1:
The patent employs self-heating pins where the pins themselves generate the required heat through resistive heating during the insertion process. This eliminates the need for external heating equipment or complex heating systems, making the manufacturing process simpler while achieving the high signal integrity required for modern high-speed applications.
Solution Approach 2:
The invention replaces complex external heating systems with a simple electrical resistive heating mechanism inherent to the pins themselves. This substitution simplifies the manufacturing process by eliminating external heating equipment while maintaining the thermal bonding process that ensures superior signal integrity.
4Power
If heated pins are used to couple with BGA, then current carrying capability is improved, but energy consumption increases during heating
Solution Approach 1:
The patent uses periodic or pulsed heating during the brief insertion process rather than continuous heating. The pins are heated only during the short time required to form the solder joint, minimizing energy consumption. The high current carrying capability is achieved through the low-resistance solder joint, while energy use is limited to the brief heating period.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in reduced insertion loss, improved signal integrity, and increased current carrying capability with lower power loss, enabling higher density and cost-effective packaging without the need for extensive retention hardware.
Implementation Method 1
The use of a substrate with embedded trace heaters and pins that heat solder elements to form a secure physical and electrical joint
Implementation Method 2
the heated plurality of pins melt the plurality of solder elements upon insertion
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, or processes for coupling or decoupling two substrates by heating pins on one of the substrates and either inserting or withdrawing the heated pins from solder elements on a BGA. In particular, by heating a plurality of pins on a first side of a first substrate, where the plurality of pins are substantially perpendicular to a plane of the substrate, inserting the heated plurality of pins into BGA attached to a second substrate where the BGA includes a plurality of solder elements aligned with the plurality of pins and where the heated plurality of pins melt the plurality of solder elements upon insertion. The inserted plurality of pins physically and/or electrically couple the first substrate and the second substrate.