Heated Process Kit Top Plate for Low-Particle Substrate Processing
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Solution Overview
Problem
Contaminants and etched materials accumulate on process kits in substrate processing chambers, leading to downtime and reduced throughput due to flaking and interference with downstream processing.
Innovation Solution
A process kit with a top plate equipped with heaters and temperature sensors, which actively heats the kit to reduce contaminant buildup and is integrated with a gas flow path to generate plasma for substrate processing, minimizing particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If process kits are used to reduce contaminant deposition on chamber surfaces, then chamber cleanliness is improved, but contaminants accumulate on the process kit itself and flake off into particles
Solution Approach 1:
The patent applies parameter changes by heating the process kit to elevated temperatures (e.g., 50-150°C) to alter the physical state of contaminants on the process kit surface. This thermal parameter change prevents contaminant accumulation and flaking by maintaining contaminants in a adhered state, thereby reducing particle generation while preserving the chamber cleanliness benefit
Solution Approach 2:
The patent converts the harmful effect of contaminant accumulation on the process kit into a beneficial effect by using controlled heating to prevent flaking. The heat treatment that would normally be considered a separate maintenance operation is integrated into the processing cycle, transforming a harmful accumulation issue into a controlled preventive measure that reduces particle generation
2Object-generated harmful factors
If pasting process is performed periodically to deposit material over the process kit to glue down contaminants, then particle generation is reduced, but additional downtime is required and throughput decreases
Solution Approach 1:
The patent implements continuity of useful action by maintaining heated conditions during substrate processing to continuously prevent contaminant flaking. This eliminates the need for periodic pasting operations and maintains continuous productive operation, thereby preserving throughput while reducing particle generation
Solution Approach 2:
The process kit performs self-service by using integrated heating elements to automatically prevent contaminant accumulation and flaking during normal operation. This self-maintenance capability eliminates the need for external pasting operations and external intervention, maintaining continuous production without downtime
3Object-generated harmful factors
If heaters are embedded in the top plate to actively heat the process kit, then contaminant buildup is reduced, but device complexity increases
Solution Approach 1:
The patent applies merging by integrating heating elements directly into the process kit structure, combining the contaminant prevention function with the existing process kit components. This integration approach reduces overall system complexity compared to using separate external heating systems, while effectively preventing contaminant accumulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces particle flaking by 92-96% and decreases downtime for maintenance, enhancing substrate processing throughput and product quality.
Implementation Method 1
at least one heater embedded in the top plate
Implementation Method 2
generating plasma from the plasma forming gas above a substrate support in the interior volume
Data Source
AI summary
Methods and apparatus for substrate processing are provided that use a process kit for use in a process chamber, comprising: a top plate having a top side and a bottom side; a plurality of holes disposed on the bottom side; a channel extending from an outer portion of the top plate and coupled to the plurality of holes; at least one heater embedded in the top plate; and at least one temperature sensor embedded in the top plate, wherein a gas flow path extends from the channel, through the plurality of holes, and into an interior volume of the process chamber.