Heated Purge Vent Fluid for Semiconductor Load Lock Moisture Control

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Solution Overview

Problem

Semiconductor processing systems face challenges in controlling moisture, which can lead to corrosion and affect the properties of material layers deposited, due to infiltration of water vapor and residual precursors, despite existing countermeasures like elevated internal pressure and purge flows.

Innovation Solution

A semiconductor processing system with a heated purge/vent fluid arrangement that includes a heater element and a controller to transfer substrates, heat a purge/vent fluid, and remove moisture from the load lock, using a hygrometer to adjust the mass flow based on dew point measurements, ensuring effective moisture control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If internal elevated pressure is maintained to prevent moisture infiltration, then moisture infiltration is reduced, but energy consumption increases and system complexity increases

Engineering Contradiction:

Improvemoisture infiltrationVSAvoidenergy consumption

Core Design Contradiction:

Object-affected harmful factorsVSUse of energy by moving object

Solution Approach 1:

The system performs preliminary heating of the load lock chamber and substrate before processing to prevent moisture condensation. By maintaining elevated temperature in advance, the system avoids moisture infiltration issues without requiring continuous high pressure, thereby reducing energy consumption while still protecting against harmful moisture effects.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system dynamically adjusts temperature and pressure parameters based on process requirements. Instead of maintaining constantly elevated pressure, the system uses controlled pressure changes combined with temperature control to achieve moisture prevention, reducing overall energy consumption while maintaining effectiveness.

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If purge flows are used to displace moisture, then moisture removal is improved, but processing time increases and productivity decreases

Engineering Contradiction:

Improvemoisture removalVSAvoidprocessing throughput

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

The system performs preliminary heating of the load lock chamber and substrate to evaporate moisture before the actual processing begins. This preliminary moisture removal action eliminates the need for extended purge flows during processing, thereby maintaining high processing throughput while still achieving effective moisture removal.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system uses rapid thermal processing to quickly evaporate and remove moisture in a short time period, skipping the need for prolonged purge flows. This rushing through the moisture removal process via thermal means maintains high productivity while still achieving the desired moisture removal effect.

Inventive Principle:

Principle #21Skipping (Rushing through)

3Object-affected harmful factors

If heaters are used to mobilize liquids, then moisture control is improved, but energy consumption increases

Engineering Contradiction:

Improvemoisture controlVSAvoidheating energy

Core Design Contradiction:

Object-affected harmful factorsVSUse of energy by moving object

Solution Approach 1:

The system applies heating locally to specific areas where moisture is most problematic, such as the substrate surface and critical chamber regions, rather than heating the entire system uniformly. This localized heating approach improves moisture control effectiveness while reducing overall energy consumption compared to full-system heating.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The system uses controlled temperature parameter changes to mobilize and remove moisture efficiently. By adjusting temperature profiles and rates of change, the system achieves effective moisture control with minimized energy input, avoiding excessive heating while still mobilizing liquids as needed.

Inventive Principle:

Principle #35Parameter changes

4Productivity

If moisture is not controlled, then processing speed is maintained, but material layer properties are affected and corrosion occurs

Engineering Contradiction:

Improveprocessing speedVSAvoidmaterial layer quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system performs preliminary heating and moisture removal from the substrate and chamber before material layer deposition begins. This preliminary action ensures that no moisture is present to affect material layer properties or cause corrosion, while the actual deposition process maintains high speed without interruption for moisture control.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system uses controlled thermal processing to convert the potential harm of moisture into a benefit by deliberately heating to evaporate moisture and then using the same thermal field to control the deposition process. This approach ensures material layer quality while maintaining processing speed, turning what would be a harmful factor into a useful process parameter.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively removes moisture from the load lock, preventing corrosion and ensuring consistent material layer properties by directly heating and evaporating surface and substrate moisture, and throttling fluid flow to optimize processing efficiency.

Implementation Method 1

heat a purge/vent fluid using the heater element

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

directly heating and evaporating surface and substrate moisture

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 3

flow the heated purge/vent fluid into the load lock using the purge/vent fluid inlet conduit

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

using a hygrometer to adjust the mass flow based on dew point measurements

Methodology Applied

Scientific EffectDew point measurement: Hygrometer

Data Source

PatentUS20230197472A1Systems and methods for controlling moisture in semiconductor processing systems

Publication Date: 2023.06.22 ASM IP HLDG BV

AI summary

A semiconductor processing system includes a front-end module connected to a load lock, a process module coupled to the front-end module by the load lock, a purge/vent fluid inlet conduit connected to the load lock, a heater element coupled to the load lock by the purge/vent fluid inlet conduit, and a controller. The controller is operably connected to the heater element and responsive to instructions recorded on a memory to transfer a substrate carrying substrate moisture from the front-end module into the load lock, heat a purge/vent fluid using the heater element, flow the heated purge/vent fluid into the load lock using the purge/vent fluid inlet conduit, remove the moisture from the load lock using the heated purge/vent fluid, and transfer the substrate from the load lock to the process module for processing using the process module. Moisture control methods and heated purge/vent fluid arrangements are also described.