Heated Substrate Laminate Production to Reduce Rubber Layer Peeling
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Solution Overview
Problem
Existing methods for producing protective gloves with thick surface rubber layers face issues such as increased manufacturing steps, peeling, and cracks due to multiple dip molding processes, leading to poor durability and protection performance.
Innovation Solution
A method involving a heated substrate contacted with polymer latex of 2,000 to 100,000 mPa·s viscosity to form a rubber layer with a thickness of 200 μm or more, reducing peeling and cracks, and enhancing solvent protection, comfort, and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple dip molding processes are used to form a thick surface rubber layer, then solvent protection performance is improved, but manufacturing complexity increases and durability decreases due to peeling at interfaces
Solution Approach 1:
The patent combines multiple dip molding operations into a single continuous process where the substrate is dipped once into a latex composition and then undergoes sequential heating and cooling treatments. This merging of steps achieves a thick rubber layer (200 μm or more) without requiring multiple separate dipping operations, thereby reducing manufacturing complexity while maintaining solvent protection performance.
Solution Approach 2:
The patent applies preliminary heating to the substrate before dipping into the latex composition. This pre-heating action prepares the substrate surface to facilitate uniform latex coagulation and adhesion, enabling the formation of a thick, defect-free rubber layer in a single dip operation. The preliminary action eliminates the need for multiple dipping steps and prevents interface peeling.
2Object-affected harmful factors
If multiple dip molding processes are used to form a thick surface rubber layer, then solvent protection performance is improved, but durability decreases due to peeling at interfaces
Solution Approach 1:
The substrate is pre-heated to a specific temperature range (20°C to 100°C, preferably 30°C to 80°C) before dipping into the latex composition. This preliminary heating ensures uniform heat distribution throughout the substrate, which prevents localized stress concentration and interface peeling during subsequent cooling. The result is a durable, peeling-free rubber layer with thickness of 200 μm or more that maintains excellent solvent protection.
Solution Approach 2:
The patent controls the temperature parameters precisely: heating the substrate to 20°C to 100°C before dipping, then cooling it to -50°C to 50°C after dipping. These parameter changes drive the latex to coagulate uniformly on the heated substrate surface, forming a thick, cohesive rubber layer without internal interfaces that would cause peeling. The controlled thermal parameters ensure both thickness (≥200 μm) and durability.
3Object-affected harmful factors
If a latex composition with relatively high viscosity is used for dip molding to thicken the surface rubber layer, then solvent protection performance is improved, but coagulation uniformity decreases leading to cracks
Solution Approach 1:
The patent uses a latex composition with viscosity of 10 to 10,000 mPa·s (a moderate range) and compensates by precisely controlling the temperature parameters: heating the substrate to 20°C to 100°C before dipping and cooling to -50°C to 50°C after dipping. These parameter changes ensure uniform heat distribution and controlled latex coagulation throughout the thick layer, preventing cracks while achieving the desired thickness for solvent protection.
Solution Approach 2:
The substrate is pre-heated uniformly before dipping into the latex composition. This preliminary heating ensures that the entire substrate surface, including the interior regions, reaches the optimal temperature for latex coagulation. As a result, even with a thick rubber layer formation, the coagulation proceeds uniformly without localized defects or cracks, maintaining manufacturing precision while achieving ≥200 μm thickness.
4Manufacturing precision
If the substrate is heated to a high temperature before contacting with polymer latex, then rubber layer formation is improved, but energy consumption increases
Solution Approach 1:
The patent optimizes the heating temperature parameter to a range of 20°C to 100°C (preferably 30°C to 80°C), which is sufficient to achieve uniform latex coagulation and high-quality rubber layer formation without excessive energy input. The subsequent cooling to -50°C to 50°C completes the coagulation process efficiently. These optimized parameter changes maintain manufacturing precision while reducing energy consumption compared to higher temperature treatments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a laminate with improved solvent protection, comfort, and wear resistance by forming a thick, uniform rubber layer with reduced peeling and cracking, suitable for use in protective gloves.
Implementation Method 1
contacting the substrate in a heated state with a polymer latex having a viscosity of 2,000 to 100,000 mPa·s at 25° C. to thereby coagulate the polymer latex in contact therewith
Implementation Method 2
the substrate in a heated state is contacted with the polymer latex
Data Source
AI summary
A method for producing a laminate including a substrate and a rubber layer, the rubber layer having a thickness of 200 μm or more from the surface of the substrate, the method including contacting the substrate in a heated state with a polymer latex having a viscosity of 2,000 to 100,000 mPa·s at 25° C. to thereby coagulate the polymer in contact therewith to form the rubber layer.