Heated Substrate Table Suction for Uniform Liquid Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently performing liquid processing on substrates while maintaining temperature control and preventing chemical liquid stagnation during low-speed rotation.
Innovation Solution
A substrate processing method and apparatus that includes a substrate table with a heater and a processing liquid nozzle, employing a suction process to stabilize substrate temperature and a controlled liquid supply process to ensure uniform heating and processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a non-rotating bottom movement member with heater is used to heat chemical liquid in a gap, then temperature control is improved, but chemical liquid stagnation occurs and processing efficiency deteriorates
Solution Approach 1:
The invention transitions from a static non-rotating bottom movement member to a dynamic rotating substrate table. The substrate table rotates at controlled speeds (30-50 rpm during heating, higher during processing) to prevent chemical liquid stagnation while maintaining temperature control through the heater. This dynamic approach resolves the contradiction by enabling both temperature control and processing efficiency simultaneously.
Solution Approach 2:
The invention employs periodic rotation of the substrate table with varying speeds at different stages: low-speed rotation (30-50 rpm) during heating to prevent stagnation, and higher-speed rotation during chemical liquid processing to enhance mixing and processing efficiency. This periodic variation in rotation speed resolves the contradiction between temperature control and processing efficiency.
2Temperature
If substrate is suctioned to heated substrate table, then temperature control during processing is improved, but substrate deformation may occur due to temperature difference
Solution Approach 1:
The invention performs preliminary heating of the substrate table before substrate suction. The substrate table is preheated to the target temperature (e.g., 80°C), and only after the substrate is suctioned and thermal equilibrium is approached does chemical liquid processing begin. This preliminary action prevents substrate deformation by eliminating temperature differences before processing.
Solution Approach 2:
The invention applies preliminary anti-action by pre-heating the substrate table to counteract the potential cooling effect of substrate suction. By establishing the target temperature beforehand and maintaining it through controlled heating, the system prevents substrate deformation caused by temperature gradients during the processing operation.
3Temperature
If low-speed rotation is used to prevent chemical liquid stagnation, then temperature control is improved, but processing efficiency decreases
Solution Approach 1:
The invention employs periodic variation in rotation speed: low-speed rotation (30-50 rpm) during the heating phase to prevent chemical liquid stagnation and maintain temperature uniformity, then transitions to higher-speed rotation during the chemical liquid processing phase to enhance processing efficiency. This periodic speed variation resolves the contradiction between temperature control and processing speed.
Solution Approach 2:
The invention uses dynamic speed control of the substrate table, adjusting rotation speed based on the processing stage. The system dynamically transitions from low-speed rotation for temperature control to high-speed rotation for efficient processing, resolving the contradiction by adapting the rotation speed to the specific requirements of each processing phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective liquid processing on substrates with precise temperature control and uniform heating, preventing chemical liquid stagnation and enhancing processing efficiency.
Implementation Method 1
a heater configured to heat the substrate table
Implementation Method 2
a substrate table configured to suction the substrate
Data Source
AI summary
A substrate processing method of performing liquid processing on a substrate in a substrate processing apparatus, which includes a substrate table configured to suction the substrate, a heater configured to heat the substrate table, and a processing liquid nozzle configured to supply a processing liquid to the substrate suctioned to the substrate table, includes: a suctioning process of suctioning the substrate by the substrate table when there is no temperature difference between the substrate and the substrate table or when a temperature difference between the substrate and the substrate is within a predetermined range; and after the suctioning process, a processing liquid supply process of supplying the processing liquid from the processing liquid nozzle to the substrate suctioned to the substrate table heated by the heater.