Heated Backside Substrate Polishing for Faster EUV Flatness
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Solution Overview
Problem
Current substrate polishing devices face challenges in achieving efficient and time-effective polishing of the back face of substrates due to issues like scratches leading to defocus in extreme ultraviolet exposure devices, with existing methods taking too long to achieve sufficient flatness.
Innovation Solution
A substrate treating method involving chemo-mechanical grinding with a polisher having abrasive grains distributed in a resin body, combined with heating and resist coating steps to enhance polishing rate and achieve flatness, along with controlled heating and polishing parameters to optimize the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional polishing methods are used to remove scratches and improve substrate flatness, then manufacturing precision is improved, but productivity deteriorates due to excessively long polishing time
Solution Approach 1:
The invention changes the physical-chemical parameters of the polishing system by introducing a heating mechanism that raises the substrate temperature to 50-150°C during polishing. This temperature parameter change accelerates the chemo-mechanical grinding reaction rate, thereby increasing the polishing rate and reducing the time required to achieve the required substrate flatness without compromising precision
Solution Approach 2:
The invention employs a composite polishing system that combines mechanical grinding (abrasive grains) with chemical reactions (polishing solution) and thermal energy (heating). This composite approach creates a synergistic effect where the heated substrate enhances chemical reactivity while abrasive grains provide mechanical removal, significantly increasing the overall polishing rate compared to conventional single-mechanism methods
2Manufacturing precision
If polishing treatment is extended to achieve sufficient flatness for EUV exposure, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
By changing the temperature parameter during polishing to 50-150°C, the invention accelerates the chemo-mechanical grinding process. This parameter change enables sufficient substrate flatness to be achieved in a shorter time, reducing the loss of time while maintaining the required manufacturing precision for EUV exposure applications
3Productivity
If heating is applied to increase polishing rate, then productivity is improved, but temperature control complexity increases
Solution Approach 1:
The heating mechanism serves multiple functions simultaneously: it heats the substrate to accelerate the chemo-mechanical grinding reaction (increasing polishing rate), and it also helps control the physical state of the polishing solution and substrate materials. This multi-functionality reduces the need for separate temperature control systems, thereby limiting the increase in device complexity while achieving significant productivity improvement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly reduces polishing time while ensuring sufficient substrate flatness, overcoming defocus issues in exposure devices by increasing polishing rate and preventing substrate damage.
Implementation Method 1
a heating step of heating the substrate while the polishing is performed. When the substrate is heated, a polishing rate can increase
Implementation Method 2
a polishing step of performing polishing to a back face of the substrate in a chemo-mechanical grinding manner by contacting a polisher against the back face of the rotating substrate
Data Source
AI summary
This disclosure relates to a substrate treating method and a substrate treating system. The substrate treating method includes a rotating step of rotating a substrate in a horizontal posture by a holding rotator, a polishing step of performing polishing to a back face of the substrate in a chemo-mechanical grinding manner by contacting a polisher against the back face of the rotating substrate, the polisher having a resin body where abrasive grains are distributed, a heating step of heating the substrate while the polishing is performed, a resist coating step of coating a front face of the substrate, whose back face is subject to the polishing, with a resist, and an exposing step of exposing the resist with which the front face of the substrate is coated.