Heated Substrate Support Ring Thermal Uniformity
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Solution Overview
Problem
Conventional substrate supports in semiconductor processing chambers experience poor thermal contact between the ring and the substrate support due to the ring not being integral, leading to cooler temperatures at the substrate edge, resulting in non-uniform processing rates and process non-uniformities.
Innovation Solution
Incorporating a heater within the substrate support ring and using a power supply to maintain the ring at a consistent temperature, along with clamping mechanisms to enhance thermal contact between the ring and the substrate support, ensuring an even temperature distribution across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the ring is not an integral part of the substrate support, then the ring can be easily installed and removed, but poor thermal contact occurs between the ring and substrate support
Solution Approach 1:
A thermal interface material is introduced as an intermediary substance between the ring and substrate support. This material fills the gap caused by the non-integral design, ensuring optimal thermal contact while preserving the ease of installation and removal. The thermal interface material acts as a mediator that transfers heat efficiently across the interface between two separate components.
2Ease of manufacture
If the ring is not an integral part of the substrate support, then manufacturing and assembly are simplified, but process uniformity deteriorates due to temperature variations
Solution Approach 1:
The thermal interface material serves as a mediator that compensates for the thermal discontinuity introduced by the non-integral ring design. This allows the system to maintain manufacturing simplicity while achieving process uniformity through the thermal bridging provided by the interface material.
Solution Approach 2:
The thermal interface material changes the thermal parameters at the interface between the ring and substrate support. By introducing a material with specific thermal conductivity properties, the system optimizes heat transfer across the interface, ensuring uniform temperature distribution and consistent processing conditions.
3Adaptability or versatility
If the ring is not an integral part of the substrate support, then component flexibility increases, but temperature distribution uniformity decreases
Solution Approach 1:
The thermal interface material acts as a mediator that bridges the thermal gap created by flexible, non-integral ring components. This enables the system to maintain component flexibility and adaptability while ensuring uniform temperature distribution through enhanced thermal coupling at the interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces or eliminates process non-uniformities by maintaining a uniform temperature across the substrate, improving processing consistency by maintaining the ring's temperature closer to that of the substrate support.
Implementation Method 1
the ring comprises a heater; and a power supply coupled to the heater to provide power to the heater
Implementation Method 2
the poor thermal contact between the ring and substrate support causes cooler temperatures proximate an edge of a substrate disposed on the substrate support during processing
Data Source
AI summary
Embodiments of substrate support rings are provided herein. In some embodiments, an apparatus for processing substrates includes, a ring configured to be disposed about a peripheral edge of a substrate support to support at least a portion of a substrate disposed atop the substrate support, wherein the ring comprises a heater; and a power supply coupled to the heater to provide power to the heater.