Heated Transfer Arm for Substrate Temperature Control

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Solution Overview

Problem

Existing substrate processing systems require separate heating chambers and suffer from heat loss during substrate transfer, which affects temperature control and efficiency.

Innovation Solution

A substrate processing system that integrates a transfer arm with a heater to maintain and control substrate temperature without a separate heating chamber, allowing simultaneous heating of the lower surface and temperature measurement of the upper surface, while reducing heat loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a separate heating chamber is used to maintain substrate temperature, then temperature control is achieved, but device complexity and space requirements increase

Engineering Contradiction:

Improvesubstrate temperature controlVSAvoidsystem structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heating function is merged with the transfer arm structure by integrating a heater into the transfer arm itself. This allows the transfer arm to simultaneously perform substrate transport and heating functions, eliminating the need for a separate heating chamber and reducing overall system complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The transfer arm is designed with multi-functionality, serving both as a transport mechanism and as a heating device. The heater integrated into the transfer arm enables it to maintain substrate temperature during transfer operations, combining previously separate functions into a single component.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If substrate is transferred through a central chamber to multiple process chambers, then processing efficiency is improved, but heat loss during transfer increases

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidheat loss during transfer

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The heater in the transfer arm pre-heats the substrate during the transfer process itself, compensating for heat loss as the substrate moves through the central chamber. This preliminary heating action ensures temperature maintenance without requiring additional heating chambers.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The heater integrated into the transfer arm acts as an intermediary heating source that directly contacts or closely approaches the substrate during transfer. This intermediary heating mechanism efficiently compensates for heat loss in the central chamber environment.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Use of energy by moving object

If the heater is positioned to contact the transfer arm, then heating efficiency is improved, but risk of direct flame contact with substrate increases

Engineering Contradiction:

Improveheating efficiencyVSAvoiddirect flame contact risk

Core Design Contradiction:

Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

The heater is positioned to contact or closely approach the transfer arm at specific locations away from the substrate surface. This localized heating arrangement maintains high heating efficiency through thermal conduction to the transfer arm, which then transfers heat to the substrate without direct flame contact, eliminating the harmful effect.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The transfer arm serves as an intermediary between the heater and the substrate. The heater contacts the transfer arm to receive thermal energy, which is then transferred to the substrate through the transfer arm structure, preventing direct contact between the heat source and substrate while maintaining heating efficiency.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances temperature control and efficiency by eliminating the need for a separate heating chamber and minimizing heat loss during substrate transfer, improving space utilization and process efficiency.

Implementation Method 1

a first heater configured to contact the transfer arm and heat the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the connector includes at least one heater configured to emit heat

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS20250343059A1Substrate processing system

Publication Date: 2025.11.06 SAMSUNG ELECTRONICS CO LTD

AI summary

A substrate processing system may include a substrate moving device that includes a transfer chamber including a central space, a transfer arm in the central space and configured to move a substrate, and a first heater configured to contact the transfer arm and heat the substrate. The transfer arm may include an arm body configured to rotate about a first axis, and a substrate support configured to support the substrate and connected to the arm body. The first heater may overlap with at least a portion of an outer surface of the substrate support.