Heated Low-Emissivity Valve Body for Clean Process Gas Flow Control

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Solution Overview

Problem

Foreign matter tends to adhere to the valve body in a flow path due to stagnation and turbulence of process gases, especially when the valve body is at a lower temperature than the pipes, which can lead to inefficiencies and maintenance issues.

Innovation Solution

The valve body is heated to a higher temperature than the pipes and configured with a lower emissivity than the pipes, using heating mechanisms and emissivity adjustments to minimize temperature drops and reduce adhesion of foreign matter.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the valve body is placed in the flow path to control gas flow, then the flow rate control function is improved, but foreign matter adheres to the valve body due to stagnation and turbulence

Engineering Contradiction:

Improveflow rate controlVSAvoidforeign matter adhesion

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The valve body temperature is changed from ambient or lower to higher than the surrounding pipes, creating a temperature gradient that prevents foreign matter adhesion. This parameter change (temperature) directly addresses the harmful effect while preserving the flow control function.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The valve body is preheated to a higher temperature before the process gas arrives, creating a thermal environment that prevents foreign matter from adhering in the first place. This preliminary thermal preparation eliminates the adhesion problem before it occurs.

Inventive Principle:

Principle #10Preliminary action

2Object-affected harmful factors

If the valve body temperature is increased to prevent foreign matter adhesion, then foreign matter adhesion is reduced, but energy consumption increases

Engineering Contradiction:

Improveforeign matter adhesionVSAvoidenergy consumption

Core Design Contradiction:

Object-affected harmful factorsVSUse of energy by moving object

Solution Approach 1:

Only the valve body surface that contacts the process gas is heated to high temperature, while other parts of the system remain at ambient temperature. This localized heating minimizes energy consumption while effectively preventing foreign matter adhesion at the critical location.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The temperature difference between the heated valve body and surrounding pipes, which could be considered a waste of energy, is converted into a beneficial thermal field that actively prevents foreign matter adhesion. The energy input creates a protective thermal environment.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If the emissivity of the valve body surface is decreased to maintain temperature, then temperature stability is improved, but heat radiation increases

Engineering Contradiction:

Improvetemperature stabilityVSAvoidheat radiation

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The emissivity parameter of the valve body surface is changed from high to low, fundamentally altering the thermal radiation characteristics. This parameter change enables the valve body to maintain its elevated temperature while minimizing energy loss through radiation.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration suppresses the adhesion of foreign matter to the valve body, maintaining its temperature and reducing maintenance frequency while enhancing the efficiency of gas flow control.

Implementation Method 1

a valve body rotatably supported about an axis intersecting with a direction of a gas flow in a flow path for a process gas at least partially formed by a pipe, heated to a higher temperature than the pipe

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

configured such that an emissivity of at least a portion of a surface of the valve body is set to be equal to or lower than an emissivity of an inner surface of the pipe

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS20260016101A1Flow rate controller, substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

Publication Date: 2026.01.15 KOKUSAI DENKI KK

AI summary

A technique includes a valve body rotatably supported about an axis intersecting with a direction of a gas flow in a flow path for a process gas at least partially formed by a pipe, heated to a higher temperature than the pipe, and configured such that an emissivity of at least a portion of a surface of the valve body is set to be equal to or lower than an emissivity of an inner surface of the pipe; and a driver configured to rotate the valve body to change an opening degree of the flow path.