Heated Flow Control Valve Body With Low Emissivity Against Particle Adhesion
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Solution Overview
Problem
Foreign matter tends to adhere to the valve body in a flow path due to stagnation and turbulence of process gases, especially when the valve body is at a lower temperature than the pipes, which can lead to inefficiencies and maintenance issues.
Innovation Solution
The valve body is heated to a higher temperature than the pipes and configured with a lower emissivity than the pipes, using mechanisms such as electrolytic polishing or metallic luster films to reduce thermal radiation and promote convection heat conduction, thereby maintaining a stable temperature and reducing foreign matter adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the valve body is heated to a higher temperature than the pipe, then foreign matter adhesion is reduced, but energy consumption increases
Solution Approach 1:
The patent applies parameter changes by modifying the emissivity of the valve body surface through electrolytic polishing or applying low-emissivity films. This changes the thermal radiation characteristics, allowing the valve body to maintain higher temperature with reduced energy input by minimizing radiative heat loss to the surrounding pipes.
Solution Approach 2:
The patent replaces direct thermal conduction heating with radiative heating control. By changing the surface emissivity, the system uses thermal radiation principles to maintain temperature differential between valve body and pipes, reducing reliance on continuous high-energy heating mechanisms.
2Temperature
If the emissivity of the valve body surface is reduced, then thermal radiation is suppressed and temperature is maintained, but manufacturing complexity increases
Solution Approach 1:
The patent modifies the surface emissivity parameter through electrolytic polishing or application of low-emissivity films. This parameter change reduces thermal radiation from the valve body surface, enabling temperature maintenance with lower energy input while preventing foreign matter adhesion.
Solution Approach 2:
The patent applies surface treatments that change the optical properties of the valve body surface. Electrolytic polishing creates a smooth, reflective surface, or low-emissivity films are applied, both of which reduce emissivity and alter the surface's thermal radiation characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the adhesion of foreign matter to the valve body, maintaining operational efficiency and reducing maintenance frequency while minimizing energy consumption and manufacturing costs.
Implementation Method 1
promote convection heat conduction, thereby maintaining a stable temperature
Implementation Method 2
configured with a lower emissivity than the pipes, using mechanisms such as electrolytic polishing or metallic luster films to reduce thermal radiation
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A technique includes a valve body (58) rotatably supported about an axis intersecting with a direction of a gas flow in a flow path for a process gas at least partially formed by a pipe (52A, 52B), said valve body (58) being heated to a higher temperature than the pipe (52A, 52B), and configured such that an emissivity of at least a portion of a surface of the valve body (58) is set to be equal to or lower than an emissivity of an inner surface of the pipe (52A, 52B); and a driver (90) configured to rotate the valve body (58) to change an opening degree of the flow path.