Heated Multi-Slot Wafer Retainer for Low-Temperature-Loss Loading
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Solution Overview
Problem
Current substrate processing methods in semiconductor manufacturing face productivity challenges due to temperature fluctuations and inefficiencies in handling multiple wafers, leading to prolonged processing times and reduced efficiency.
Innovation Solution
A substrate processing apparatus that heats a substrate retainer with multiple slots, allowing for partial movement outside the reaction chamber to discharge and charge wafers while maintaining a heated environment, thereby minimizing temperature drops and optimizing wafer handling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate retainer is completely removed from the reaction chamber to charge substrates, then the charging operation can be performed, but the temperature drops significantly
Solution Approach 1:
The substrate retainer is divided into multiple slots, allowing partial removal. Only the necessary number of slots are moved outside the reaction chamber for substrate charging, while the remaining slots stay inside to maintain temperature. This segmentation enables selective substrate charging without complete removal, thus minimizing temperature drop.
Solution Approach 2:
Instead of completely removing the substrate retainer from the reaction chamber, only a partial portion (one or more slots) is moved outside for substrate charging. This partial action achieves the necessary charging operation while minimizing the loss of thermal environment in the reaction chamber.
2Manufacturing precision
If multiple wafers are processed in separate batches, then each wafer receives adequate processing attention, but the overall processing time increases
Solution Approach 1:
Multiple substrate slots are combined in a single retainer structure, allowing multiple wafers to be processed simultaneously in the reaction chamber. This merging approach enables parallel processing of multiple substrates while maintaining consistent processing conditions, thereby reducing total processing time without compromising quality.
Solution Approach 2:
The substrate retainer enables continuous processing by allowing multiple wafers to be present in the reaction chamber simultaneously. While one wafer is being processed, another can be prepared for charging, creating a continuous workflow that eliminates idle time between batches and maintains steady-state processing conditions.
3Productivity
If the substrate retainer is designed to hold many substrates, then productivity increases, but the complexity of moving and positioning the retainer increases
Solution Approach 1:
The retainer is segmented into multiple independent slots that can be selectively positioned. This segmentation allows the system to move only the necessary number of slots outside the reaction chamber rather than the entire retainer structure, reducing the complexity of positioning mechanisms while maintaining high substrate capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances productivity by maintaining a consistent temperature and reducing processing time, allowing for safer and more reliable wafer discharge and charging, while simplifying the apparatus configuration and reducing energy consumption.
Implementation Method 1
heating a substrate retainer in a reaction chamber
Data Source
AI summary
According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) heating a substrate retainer in a reaction chamber, wherein the substrate retainer is provided with a plurality of slots capable of accommodating a plurality of substrates in a multistage manner; (b) repeatedly performing a set including: (b-1) moving the substrate retainer so as to locate one or more of the slots outside the reaction chamber; and (b-2) charging one or more of the substrates into the one or more of the slots; and (c) moving the substrate retainer such that the plurality of substrates charged in the plurality of slots are accommodated in the reaction chamber.