Heater Assembly with 180-Degree Bend for Uniform Thermal Control

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Solution Overview

Problem

Current high-throughput chemical treatment systems face low throughput due to the inefficiencies in processing multiple substrates simultaneously, particularly in dry, non-plasma processes like etching and cleaning, which require consistent and repeatable process characteristics across substrates.

Innovation Solution

A heater assembly with resistive heating elements configured in a 180-degree major-axis bend is integrated into the chemical treatment system to uniformly heat processing elements, such as gas injection assemblies and substrate holders, allowing for controlled temperature management across multiple substrates, thereby enhancing processing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple substrates are processed simultaneously to increase throughput, then productivity improves, but manufacturing precision deteriorates due to difficulty in maintaining consistent process characteristics

Engineering Contradiction:
ImprovethroughputVSAvoidprocess consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The heater assembly is divided into multiple independent heating zones, each capable of independent temperature control. This segmentation allows different regions of the processing chamber to maintain optimal temperatures for different substrates simultaneously, ensuring process consistency while handling multiple substrates in parallel

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each heating zone is designed with localized temperature control capabilities, allowing different temperature profiles to be applied to different areas of the processing chamber. This enables precise temperature management for each substrate position, maintaining manufacturing precision across multiple substrates processed simultaneously

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If heating elements are added to control temperature across multiple substrates, then manufacturing precision improves, but device complexity increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidheater assembly complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The heater assembly uses a standardized modular design where identical heating elements and control mechanisms are reused across multiple zones. This multi-functional approach allows the same component design to serve multiple substrates simultaneously, improving temperature uniformity without proportionally increasing device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The heating elements are positioned and configured to create uniform heat distribution across all substrate positions. By establishing equipotential temperature zones, the system achieves consistent thermal conditions across multiple substrates using a relatively simple and symmetric heater assembly design

Inventive Principle:
Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the throughput of chemical and thermal treatments by ensuring uniform temperature control across multiple substrates, optimizing the etching and cleaning processes, and increasing the efficiency of dry, non-plasma processes.

Implementation Method 1

a plurality of resistive heating elements coupled to the upper surface of the plate member

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS8115140B2Heater assembly for high throughput chemical treatment system
Publication Date: 2012.02.14 TOKYO ELECTRON LTD
  • US8115140B2 patent drawing
  • US8115140B2 patent drawing
  • US8115140B2 patent drawing

AI summary

A heater assembly configured to elevate a temperature of a processing element in a chemical treatment system is described. The heater assembly may be configured to uniformly heat a large area processing element, such as a processing element that spans a plurality of substrates. Additionally, for example, the heater assembly may be configured to elevate a temperature of an upper assembly, a gas injection assembly, a substrate holder, a chamber wall, or any combination of two or more thereof.