Semiconductor Heater Base With Elastic Bending for Thermal Expansion
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Solution Overview
Problem
The existing semiconductor processing heaters face connection failures due to thermal expansion and deformation of the heating disc, leading to poor structural strength and inconsistent heating performance.
Innovation Solution
A heater design incorporating a base with an elastic bending structure that supports the heating body, allowing for adaptive deformation to absorb expansion forces and maintain connection integrity, while reducing heat transfer to the base through a thin-walled wall arrangement and insulation components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the wall and base body are rigidly connected to support the heating body, then the structural strength is improved, but the connection fails due to thermal expansion and deformation
Solution Approach 1:
The patent changes the mechanical parameters of the connection structure by introducing an elastic bending structure that can deform under thermal stress. This elastic structure allows the connection to accommodate thermal expansion while maintaining structural integrity, resolving the contradiction between rigid strength and thermal reliability
Solution Approach 2:
The patent transforms the static rigid connection into a dynamic system where the elastic bending structure can adaptively deform in response to thermal expansion forces. This dynamic capability allows the connection to maintain reliability under varying thermal conditions while preserving overall structural strength
2Temperature
If the wall is made thin to reduce heat transfer to the base, then the heating performance consistency is improved, but the structural strength of the wall is reduced
Solution Approach 1:
The patent changes the wall thickness parameter to optimize thermal insulation performance. By making the wall thin, heat transfer to the base is reduced, ensuring uniform temperature distribution across the heating body. The elastic bending structure compensates for the reduced wall strength by providing the necessary mechanical support and thermal expansion accommodation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a high structural strength and consistent heating performance by preventing connection failures and maintaining uniform temperature distribution across the heating body, enhancing the reliability and efficiency of semiconductor processing.
Implementation Method 1
The elastic bending structure is configured to cause the wall and the heating body to remain connected by generating an elastic deformation when the wall and/or the base body expand to deform
Implementation Method 2
During a semiconductor processing process, a semiconductor is usually heated by a heater
Data Source
AI summary
The present disclosure provides a heater and a heating base. The heater is used in a semiconductor process apparatus and includes a heating body and a base configured to support the heating body. The base includes a base body and a plate connected to each other. The base body is opposite to the heating body and arranged at an interval. The plate is arranged between the base body and the heating body and is fixedly connected to the heating body. An elastic bending structure is arranged on at least one of the plate, the base body, or the connection place between the plate and the base body. The elastic bending structure is configured to cause the plate and the heating body to remain connected by generating elastic deformation when the plate and the base body expand and deform.