Heater Chip Bondpad Reduction via Multi-Side Power Routing

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Solution Overview

Problem

Inkjet heater chips require a high number of bondpads and power routes, which increases chip size and cost, as each bondpad typically supplies power only to heaters on one side of the ink via, limiting the ability to minimize the number of bondpads necessary to power heater arrays effectively.

Innovation Solution

A heater chip design where a single bondpad supplies power to heater arrays on both sides of an ink via using physically separated power traces, reducing the number of bondpads required and optimizing chip area usage, with each bondpad capable of powering multiple heater arrays and reducing the current needed for simultaneous firing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If each bondpad supplies power only to heaters on one side of the ink via, then the power distribution is simple and reliable, but the number of bondpads increases, increasing chip area and cost

Engineering Contradiction:

Improvepower distribution reliabilityVSAvoidchip area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

A single bondpad is designed to supply power to heater arrays on both sides of the ink via through separate power traces, making the bondpad multi-functional. This reduces the total number of bondpads required on the chip, thereby reducing chip area and cost while maintaining reliable power distribution to all heater arrays

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The power distribution from a single bondpad is segmented into multiple physically separated power traces, with each trace independently routing power to heater arrays on different sides of the ink via. This segmentation allows one bondpad to serve multiple functions without compromising power distribution reliability

Inventive Principle:

Principle #1Segmentation

2Area of stationary object

If the number of bondpads is reduced, then chip area and cost decrease, but the complexity of power routing increases

Engineering Contradiction:

Improvechip areaVSAvoidpower routing complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The power routing is segmented into multiple physically separated traces that originate from a single bondpad. Each trace is independently routed to heater arrays on different sides of the ink via, which simplifies the overall routing architecture compared to requiring multiple bondpads with extensive inter-bondpad routing

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The power traces are routed in different spatial dimensions and paths around the ink via, utilizing the three-dimensional chip layout to physically separate the traces. This dimensional approach allows complex power distribution from a single bondpad without increasing routing complexity on the chip surface

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If more power traces are used to reach heaters on both sides, then power distribution efficiency improves, but chip area increases

Engineering Contradiction:

Improvepower distribution efficiencyVSAvoidchip area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

A single bondpad performs multiple power distribution functions by supplying power to heater arrays on both sides of the ink via through separate traces. This multi-functional approach achieves efficient power distribution to all heaters while minimizing the area occupied by bondpads and their associated routing

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The power distribution functions for both sides of the ink via are merged into a single bondpad architecture. By combining multiple power supply functions into one bondpad with multiple traces, the chip area is optimized while maintaining efficient power distribution to all heater arrays

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration minimizes the number of bondpads needed, saving chip space and reducing the cost of heater chips, while maintaining efficient power distribution to heater arrays, allowing for higher printing resolutions and reduced power consumption.

Implementation Method 1

The heaters provide thermal energy that causes the discharge of a droplet of ink

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS7290864B2Heater chips with a reduced number of bondpads

Publication Date: 2007.11.06 SLINGSHOT PRINTING LLC

AI summary

Heater chips for use in printing devices, such as those including one or more ink vias and one or more heater arrays, where at least a portion of at least one the ink vias is associated with at least portions of at least two heater arrays. The first heater array can be adjacent to one side of at least a portion of the ink via and a second heater array can be adjacent to another side of at least a portion of the ink via. The heater chip can also include a bondpad supplying power to at least a portion of the first heater array and to at least a portion of the second heater array.