Warm Air Heater Driving Circuit Layout for Thyristor Cooling

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Solution Overview

Problem

The existing warm air heaters in intelligent toilet bowls face issues with poor heat dissipation in the driving circuit, leading to thermal breakdown of thyristors due to high power consumption and limited space for large-area heat sinks, which affects the overall performance of the main control circuit board.

Innovation Solution

The driving circuit board with a silicon-controlled element is positioned within the air duct of the warm air heater, upstream or level with the heating part, allowing cold wind from the fan to directly cool the thyristor, eliminating the need for large heat radiating fins and minimizing the space required for the main control circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a large-area heat sink is disposed on the main control circuit board to improve heat dissipation of the thyristor, then the heat dissipation efficiency of the thyristor is improved, but the space of the installation position is insufficient and the overall internal temperature of the space increases

Engineering Contradiction:
Improveheat dissipation efficiency of thyristorVSAvoidinstallation space of main control circuit board
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent divides the heat dissipation function from the main control circuit board by placing the thyristor on a separate driving circuit board. This segmentation allows the heat sink to be positioned independently in the air duct where space is available, resolving the space constraint on the main circuit board while maintaining effective heat dissipation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions the heat dissipation solution from a two-dimensional plane (main circuit board surface) to a three-dimensional space (air duct volume) by positioning the driving circuit board vertically in the air duct. This allows the heat sink to utilize the vertical space and airflow path for efficient heat dissipation without occupying valuable horizontal board space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If the driving circuit is disposed on the main control circuit board, then the control function is integrated, but the space for heat dissipation is limited and the internal temperature increases

Engineering Contradiction:
Improveintegration of control functionVSAvoidinternal temperature of installation space
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent segments the driving circuit from the main control circuit board, placing the thyristor and its heat sink on a separate driving circuit board positioned in the air duct. This maintains functional integration through electrical connections while physically separating the heat-generating components to prevent temperature buildup in the main circuit board area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces cold air from the fan as an intermediary cooling medium that flows through the air duct and directly cools the thyristor on the driving circuit board. This intermediary airflow provides efficient heat removal without requiring the main control circuit board to accommodate large heat dissipation structures.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If cold wind is used to cool the silicon-controlled element, then the cooling effect is improved, but the driving circuit board must be positioned in the air duct

Engineering Contradiction:
Improvetemperature of silicon-controlled elementVSAvoidpositioning space in air duct
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent positions the driving circuit board vertically in the air duct, utilizing the third dimension (height/vertical space) rather than occupying horizontal space. This allows the cold air flow to directly pass over the silicon-controlled element, providing efficient cooling while maintaining proper positioning within the air duct structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration achieves effective cooling of the silicon-controlled element without adding large heat radiating fins, reduces costs, and minimizes the size of the main control circuit board while maintaining efficient heat dissipation, thus enhancing the performance and reliability of the warm air heater.

Implementation Method 1

the cold wind from the fan can directly cool down the silicon-controlled element on the driving circuit board

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

The driving circuit can drive the electric current change in the heater block J and change the temperature of the heater block J

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20230097894A1Driving part of warm air heater and warm air heater
Publication Date: 2023.03.30 SHANGHAI KOHLER ELECTRONICS TECH
  • US20230097894A1 patent drawing
  • US20230097894A1 patent drawing
  • US20230097894A1 patent drawing

AI summary

The present disclosure provides a driving part of a warm air heater and the warm air heater, wherein the driving part comprises a driving circuit board, and a silicon-controlled element is arranged on the driving circuit board; the driving circuit board is arranged in an air duct of the warm air heater, and the driving circuit board is positioned at the upstream of the heating part or is flush with the heating part, wherein the upstream or the flush is based on the direction of air flow in the air duct. The driving part of the present disclosure utilizes the fan to cool the silicon-controlled element without adding large-area radiating fins, thus reducing the cost of the driving part, and the driving circuit board is not arranged on the main control circuit board anymore, thus realizing the miniaturization of the main control part.