Heater-Embedded Ceramic Package for Oven Controlled Crystal Oscillator
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Solution Overview
Problem
The existing oven controlled crystal oscillators suffer from poor thermal uniformity due to asymmetric thermal fields caused by the integrated heater, leading to temperature differences between the crystal blank and the IC chip, which affects temperature control and increases power consumption.
Innovation Solution
The implementation of a heater-embedded ceramic package with an integrated circuit and crystal blank positioned symmetrically around the embedded heater layer, establishing a symmetric thermal field to achieve uniform heating and reduce power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heater is integrated inside the IC chip to maintain specific working temperature, then the temperature control function is achieved, but the thermal uniformity deteriorates due to asymmetric thermal field
Solution Approach 1:
The patent intentionally introduces asymmetric thermal insulation structures (insulation layers and air gaps) on one side of the heater to compensate for the inherent asymmetry of the IC chip structure. This creates a balanced symmetric thermal field distribution, resolving the thermal uniformity problem while maintaining temperature control functionality.
2Device complexity
If the heater is integrated inside the IC chip, then the device integration is improved, but the temperature difference between crystal blank and IC chip increases
Solution Approach 1:
The patent applies localized thermal insulation measures (insulation layers at specific positions, air gaps between components) to create different thermal characteristics in different regions. This local modification of thermal properties reduces the temperature difference between the crystal blank and IC chip while maintaining high device integration.
3Device complexity
If the asymmetric thermal field structure is used, then the device structure is simplified, but the power consumption increases due to poor thermal uniformity
Solution Approach 1:
The patent converts the harmful asymmetric thermal field into a beneficial symmetric thermal distribution by strategically placing insulation layers and air gaps. This transforms the originally harmful thermal asymmetry into a controlled and optimized thermal environment, improving thermal uniformity while maintaining structural simplicity and reducing power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces temperature gradients between the crystal blank and the IC chip, enhancing thermal uniformity, maintaining oven stability, and minimizing power consumption.
Implementation Method 1
A central top of the substrate is provided with a first cavity. The heater-embedded crystal ceramic package has a first embedded heater layer
Implementation Method 2
The first embedded heater layer establishes a symmetric thermal field with respect to the first IC chip and the crystal blank
Data Source
AI summary
An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.