Heater Plate V-Groove Busbar Layout for Precise Heat Control
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Solution Overview
Problem
Existing heater plates are inefficient to manufacture and lack efficient methods for their production.
Innovation Solution
A heater plate design featuring a carrier plate with V-shaped grooves and busbars, utilizing anisotropic etching of silicon to create precise electrical connections, and a resistive heating layer, allowing for efficient manufacturing and improved heat control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing methods are used for heater plates, then manufacturing simplicity is maintained, but manufacturing efficiency and precision are insufficient
Solution Approach 1:
The heater plate is segmented into distinct functional regions: a carrier plate substrate, V-shaped grooves for busbar accommodation, resistive heating layers, and slit-shaped openings for electrical connections. This segmentation allows each component to be manufactured and optimized independently, improving overall manufacturing efficiency while maintaining clarity in the complex structure
Solution Approach 2:
The V-shaped grooves are pre-formed in the carrier plate before depositing the resistive heating layer and busbars. This preliminary structuring of the substrate enables subsequent components to be added in a systematic manner, reducing manufacturing complexity by establishing the foundation first
2Manufacturing precision
If standard etching processes are used, then manufacturing simplicity is maintained, but manufacturing precision of V-shaped grooves is insufficient
Solution Approach 1:
The patent specifies precise parameters for the etching process: using KOH or TMAH etchants on 1-0-0 oriented silicon to achieve a specific wall angle of 54.74 degrees. By controlling etchant concentration, exposure time, and temperature, the V-shaped grooves are formed with high precision while maintaining relative manufacturing simplicity
Solution Approach 2:
The mechanical precision requirement is met through chemical etching rather than mechanical machining. The anisotropic chemical etching process naturally produces the desired V-shape with precise wall angles, replacing complex mechanical operations with a simpler chemical process that achieves higher precision
3Manufacturing precision
If slit-shaped openings are formed with varying width due to thickness variations, then manufacturing simplicity is maintained, but electrical connection precision is insufficient
Solution Approach 1:
The patent addresses local variations in carrier plate thickness by allowing the slit-shaped openings to have varying widths corresponding to local thickness variations. This local adaptation ensures that electrical connections remain precise despite overall thickness variations, avoiding the need for complex uniform thickness control across the entire plate
Solution Approach 2:
Instead of attempting to control every local thickness variation perfectly, the patent accepts partial variations and designs the slit openings to accommodate them. The etching process is continued until the etchant has fully protruded the carrier plate, ensuring complete penetration even in thicker regions, which is an excessive action that guarantees connection precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient manufacturing and enhances heat induction control with higher resolution capabilities, suitable for various printing applications.
Implementation Method 1
a viscous functional material is heated with the resistive heater elements so a vapor pressure is induced at an interface of the functional material and the plate
Implementation Method 2
the carrier plate is provided of a material having an anisotropic etching behavior, such as silicon. Due to the anisotropic etching behavior of the material of the carrier plate the V-shaped grooves can be formed with a well defined wall angle in a simple etching process
Implementation Method 3
a viscous functional material is heated with the resistive heater elements so a vapor pressure is induced at an interface of the functional material and the plate. Therewith a transfer of viscous functional material from the plate to a target surface is induced
Data Source
AI summary
An improved heater plate is provided herewith that comprises a carrier plate having a first main side and a second main side opposite the first main side. The carrier plate is provided at the first main side with a resistive heating layer and is provided with a plurality of busbars that are accommodated in respective V-shaped grooves in the carrier plate at the second main side. The V-shaped grooves taper inward in the direction of the first main side towards respective slit-shaped openings, and the busbars are electrically connected with the resistive heating layer through the respective slit-shaped openings. Also a method of manufacturing the improved heater plate is provided as well as a heater device comprising the heater plate.