In-Chamber Heater Process Kit for Wafer Temperature Uniformity
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Solution Overview
Problem
In deposition chambers, non-uniform temperature distribution caused by the pedestal or heater can lead to uneven deposition, as the substrate contacts the heater, resulting in local variations that affect the uniformity of the process.
Innovation Solution
A process kit is designed for use with an in-chamber heater and substrate rotating mechanism, featuring an upper edge ring with a skirt to prevent heat loss, a lower edge ring for alignment, a bottom plate for support, and a shadow ring for centering, which facilitates decoupling of the substrate from the heater pedestal to reduce local temperature non-uniformity by allowing rotation and repositioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the substrate contacts the heater pedestal directly, then heating efficiency is improved, but local temperature non-uniformity increases
Solution Approach 1:
The patent introduces an upper edge ring as an intermediary component between the substrate and the heater pedestal. This edge ring acts as a thermal mediator that distributes heat more uniformly across the substrate edge while maintaining heating efficiency, thereby resolving the contradiction between effective heating and temperature uniformity.
Solution Approach 2:
The patent applies local quality by providing enhanced thermal management specifically at the substrate edge region through the upper edge ring and skirt structure. This localized approach addresses temperature non-uniformity at the critical edge area without compromising overall heating efficiency.
2Stability of the object's composition
If the substrate is fixed on the heater pedestal, then processing stability is improved, but deposition uniformity deteriorates
Solution Approach 1:
The patent implements dynamics by enabling the substrate to rotate on the heater pedestal during processing. This rotational capability allows the substrate to dynamically redistribute its position relative to hot spots on the pedestal, improving deposition uniformity while maintaining processing stability through controlled rotation.
Solution Approach 2:
The upper edge ring serves as a mediator that couples the substrate to the heater pedestal while allowing relative motion. This intermediary structure enables both stable processing and rotational movement, resolving the contradiction between stability and uniformity.
3Device complexity
If the heater pedestal structure is simplified, then device complexity is reduced, but heat loss increases
Solution Approach 1:
The patent employs a skirt structure that acts as a thermal barrier around the heater pedestal. This thin-walled structure effectively reduces heat loss to the chamber walls while adding minimal structural complexity, achieving energy conservation with simple geometry.
4Temperature
If the substrate support structure is added, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
The patent segments the substrate support function into multiple components: upper edge ring, lower edge ring, and skirt. This segmentation allows each component to perform a specific thermal management function, achieving temperature uniformity through distributed thermal control rather than a single complex structure.
Solution Approach 2:
The skirt structure provides thermal management with minimal material and structural complexity. This thin-walled component effectively reduces heat loss and improves temperature uniformity without adding significant device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process kit effectively reduces local non-uniform temperature distribution and improves deposition uniformity by allowing the substrate to be decoupled and repositioned relative to the heater pedestal, ensuring consistent thermal energy application across the substrate.
Implementation Method 1
the skirt covers the outer edges of the substrate support heater pedestal to prevent heat loss from the substrate support heater pedestal
Implementation Method 2
substrate support heater pedestal for supporting a substrate in a process chamber
Implementation Method 3
non-uniform radiative heat loss
Data Source
AI summary
Embodiments of the present disclosure are directed process kits for use with an in-chamber heater and substrate rotating mechanism. In some embodiments consistent with the present disclosure, a process kit for use with a rotatable substrate support heater pedestal for supporting a substrate in a process chamber may include an upper edge ring including a top ledge and a skirt the extends downward from the top ledge, a lower edge ring that at least partially supports the upper edge ring and aligns the upper edge ring with the substrate support heater pedestal, a bottom plate disposed on a bottom of the process chamber that supports the upper edge ring when the substrate support heater pedestal is in a lowered non-processing position, and a shadow ring that couples with the upper edge ring when the substrate support heater pedestal is in a raised processing position.