Substrate Heater Side Portion for Heat Retention
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Solution Overview
Problem
Existing substrate heating apparatuses face inefficiencies in heat retention and uniform heating at lower temperatures (500 to 650°C), leading to potential wafer warping and increased damage during processing, as heat generated by planar heating elements is not effectively retained or distributed.
Innovation Solution
Incorporation of a side portion extending downward from the outer peripheral portion of the planar heating element to form a heat retention space, which captures and directs heat upward, preventing lateral dissipation and enhancing heating efficiency and retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a planar heating element is used to heat substrates, then heating coverage is improved, but heat retention efficiency deteriorates due to lateral heat dissipation
Solution Approach 1:
The heating element is extended from a two-dimensional planar structure into a three-dimensional configuration by adding downward extensions along the outer peripheral portion. This dimensional transition creates a heat retention space that captures heat vertically, preventing lateral dissipation while maintaining broad heating coverage.
Solution Approach 2:
The downward extensions create a nested structure where the heat retention space is formed within the overall heating apparatus. The extensions nest around the substrate support, creating an enclosed thermal environment that traps heat without adding external heat reflectors or insulation layers.
2Temperature
If heating temperature is reduced to 500-650°C for substrate processing, then substrate damage is reduced, but heating uniformity deteriorates due to insufficient heat retention
Solution Approach 1:
The downward extensions are positioned specifically at the outer peripheral portion of the heating element, creating localized heat retention zones where heat is concentrated. This local modification ensures uniform temperature distribution across the substrate surface, particularly at lower temperatures where heat retention is critical.
3Loss of energy
If heat reflectors are added under the planar heating element to prevent heat dissipation, then heat retention efficiency is improved, but device complexity increases
Solution Approach 1:
The heating element and heat retention structure are merged into a single integrated component. The downward extensions are formed as part of the heating element itself, eliminating the need for separate heat reflectors or insulation structures that would increase device complexity.
Solution Approach 2:
The heating element serves dual functions: generating heat through its resistive heating properties and retaining heat through its three-dimensional structure with downward extensions. This multi-functionality eliminates the need for additional dedicated heat retention components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heating and heat retention efficiency, ensuring consistent temperature distribution and reducing wafer warping by effectively utilizing heat from both upper and lower surfaces of the planar heating element, even at lower processing temperatures.
Implementation Method 1
a heater provided below the substrate support substantially parallel to the substrate, and having a predetermined planar shape
Implementation Method 2
a side portion extending downward from the outer peripheral portion of the heater... captures and directs heat upward, preventing lateral dissipation
Data Source
AI summary
A substrate heating apparatus includes: a substrate support configured to substantially horizontally support a substrate; a heater provided below the substrate support substantially parallel to the substrate, and having a predetermined planar shape; and a side portion extending downward from an outer peripheral portion of the heater.