Heater Substrate with Adjustable Resistance Terminals for Uniform Heat Distribution
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Solution Overview
Problem
Existing probe card substrates face challenges in achieving uniform heat distribution and adjusting heat generation to precise target values, leading to variations in temperature across the heating region, which can affect the accuracy of semiconductor testing.
Innovation Solution
A heater substrate with an insulating substrate and a heater wire, featuring adjustment parts with terminals and conductors on the surface, allowing for adjustment of heat generation by modifying the resistance values of the adjustment conductors to match target heat levels, ensuring uniform temperature distribution across the heating region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a heater wire is used to generate heat in the heating region, then heat generation capability is improved, but uniformity of heat distribution deteriorates
Solution Approach 1:
The patent divides the heating region into multiple zones with different heater wire sections, each having different resistance values. This allows different regions to generate different amounts of heat locally, compensating for heat loss variations and achieving uniform overall heat distribution across the heating region.
2Ease of manufacture
If the heater wire resistance is fixed during manufacturing, then manufacturing simplicity is improved, but ability to adjust heat generation to target values deteriorates
Solution Approach 1:
The patent makes the heater wire resistance adjustable by providing adjustment parts that allow post-manufacturing modification of resistance values. This enables the heat generation to be dynamically adjusted to match target values while maintaining relatively simple manufacturing processes.
3Adaptability or versatility
If adjustment parts are added to modify resistance values, then heat generation adjustability is improved, but device complexity increases
Solution Approach 1:
The patent adjusts heat generation by changing the resistance parameter of the heater wire through adjustment parts. This allows precise control of heat generation without requiring complex additional heating or cooling systems, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces variations in heat generation, enabling precise temperature control and improving the accuracy of semiconductor testing by ensuring consistent heat distribution across the heating region.
Implementation Method 1
a heater wire (3) located inside the insulating substrate (1)
Data Source
AI summary
Provided is a heater substrate that includes an insulating substrate having a first surface and a second surface that is on an opposite side from the first surface, a heater wire located inside the insulating substrate, and an adjustment part that is electrically connected to the heater wire. The adjustment part includes a pair of adjustment terminals that are located on the second surface and are respectively electrically connected to two ends of a partial section of the heater wire, and an adjustment conductor that is located on the second surface and is connected to the pair of adjustment terminals. Also provided are a probe card substrate and a probe card that include the heater substrate.