Heater Design for Uniform Temperature and Cost Reduction
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Solution Overview
Problem
Existing heaters for image forming devices face challenges in reducing manufacturing costs while minimizing temperature variation across the heating surface, particularly when heating objects of different sizes, as they require heating elements of varying lengths, leading to increased material costs and potential temperature inconsistencies.
Innovation Solution
A heater design featuring a substrate with a plate shape, multiple heating elements arranged in the longitudinal direction, and overlapping wiring portions to manage temperature distribution, where the first portion overlaps with the second portion in the transverse direction, ensuring the heating elements are not in an inclusive relationship, thereby reducing material usage and temperature variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heating elements of different lengths are arranged side by side in the short direction of the substrate, then the heater can heat objects of different sizes, but the manufacturing costs increase due to expensive heating element material
Solution Approach 1:
The heating element is divided into multiple segments of different lengths arranged side by side in the short direction of the substrate. This segmentation allows the heater to accommodate objects of different sizes by selecting appropriate heating element segments, thereby achieving adaptability while reducing material usage compared to using a single long heating element for all sizes.
Solution Approach 2:
The patent transitions from a single-dimensional heating element arrangement to a two-dimensional arrangement where heating elements of different lengths are positioned side by side in the short direction of the substrate. This dimensional change enables the heater to serve multiple size requirements simultaneously, improving adaptability without proportionally increasing material costs.
2Quantity of substance
If heating elements of different lengths are arranged side by side in the short direction of the substrate, then the total length of heating elements is reduced, but temperature variation within the surface of the heater increases
Solution Approach 1:
The patent applies local quality by positioning wiring portions at specific locations where they overlap with heating element end portions. This localized wiring placement creates targeted heat generation zones that compensate for temperature variations in different regions of the heating surface, ensuring uniform temperature distribution while maintaining reduced total heating element length.
Solution Approach 2:
The patent modifies the thermal parameters by strategically placing wiring portions that generate heat at specific locations overlapping with heating element ends. This parameter change in heat generation distribution compensates for the temperature variations introduced by arranging heating elements of different lengths, achieving uniform temperature across the heating surface.
3Temperature
If wiring portions overlap with heating element end portions, then temperature uniformity is improved, but the device complexity increases
Solution Approach 1:
The patent merges the wiring portions with the heating element end portions by positioning them to overlap in the same regions. This merging approach allows the wiring to serve dual purposes: electrical connection and localized heat generation for temperature uniformity, thereby improving temperature distribution without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces manufacturing costs by minimizing the total length of heating elements while maintaining uniform temperature across the heating surface, ensuring consistent heating performance for objects of varying sizes.
Implementation Method 1
a heating element that is provided on one surface of the substrate and extends in the longitudinal direction of the substrate
Data Source
AI summary
A heater and an image forming device are provided that can reduce manufacturing costs and suppress temperature variation within the surface of the heater. The heater according to an embodiment includes: a substrate having a plate shape and extending in a first direction; a first heating element provided on one surface side of the substrate and extending in the first direction; a first wiring provided on the one surface side of the substrate and overlapping an end portion of the first heating element in the first direction; a second heating element spaced apart from the first heating element in a second direction perpendicular to the first direction on the one surface side of the substrate, and extending in the first direction; and a second wiring provided on the one surface side of the substrate and overlapping an end portion of the second heating element in the first direction. In the second direction, a first portion where the first heating element and the first wiring overlap is adjacent to a second portion where the second heating element and the second wiring overlap. In the first direction, the first portion is spaced apart from the second portion. In the second direction, the first portion faces the second heating element. In the first direction, the first heating element and the second heating element are not in an inclusive relationship with each other.


