Heater with Vacuum Gap for Uniform Wafer Heating

The patent introduces a gap (vacuum or gas-filled) as an intermediary layer between the resistance heating element and the base body. This gap acts as a thermal insulator, preventing direct heat transfer to the base body while allowing the heating element to maintain contact with the wafer for efficient heating. The gap material (vacuum or inert gas) specifically blocks heat conduction to the base body, resolving the contradiction between structural simplicity and heating uniformity.

The patent applies local quality by creating a selective thermal isolation system. The heating element maintains local contact with the wafer (high heating efficiency) while being thermally isolated from the base body (thermal stress reduction). The gap is positioned specifically at the interface between the heating element and base body, allowing different thermal conditions in different locations: efficient heat transfer to the wafer where needed, and thermal insulation from the base body where not needed.

The patent extracts the resistance heating element from direct embedding in the base body by introducing a gap between them. This extraction allows the heating element to be positioned stably within the base body structure while being thermally decoupled. The gap provides the necessary clearance for thermal expansion without generating stress, while the overall structure remains stable through the mechanical support of the base body and electrode connections.