Heating Apparatus Reflective Plate for CVD Temperature Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heating apparatuses for batch reactors in vertical-type diffusion CVD systems suffer from heat loss through ceiling heat insulators, leading to increased power consumption and deteriorated in-plane temperature uniformity of wafers.
Innovation Solution
A heating apparatus with a side wall heat insulator, an upper wall heat insulator, and a thermal compensation part that includes a reflection surface with a first emissivity less than the emissivity of the upper wall heat insulator, which reflects heat back to the reaction tube, reducing waste heat energy and optimizing temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a heater is installed outside the reaction container, then heating function is provided, but heat loss occurs through the ceiling heat insulator and power consumption increases
Solution Approach 1:
The patent applies the principle of converting harmful heat loss into beneficial heat recycling by installing a reflective plate on the lower surface of the upper wall heat insulator. This reflective plate captures heat that would otherwise be lost through the ceiling and redirects it back to the reaction container, transforming energy waste into useful heating contribution and reducing overall power consumption
Solution Approach 2:
The patent modifies the emissivity parameter of the heat insulator surface by adding a reflective plate with low emissivity on the lower surface of the upper wall heat insulator. This parameter change reduces radiative heat loss and redirects thermal energy back to the reaction container, improving heating efficiency
2Temperature
If a heater is installed outside the reaction container, then heating function is provided, but in-plane temperature uniformity of the wafer deteriorates
Solution Approach 1:
The reflective plate captures heat loss from the ceiling and redirects it back to the reaction container, specifically compensating for temperature uniformity issues. The reflected heat helps maintain consistent temperature distribution across the wafer surface, addressing the deterioration of in-plane temperature uniformity
Solution Approach 2:
By changing the emissivity parameter of the upper wall heat insulator's lower surface through the reflective plate, the patent alters the heat distribution pattern. This parameter modification ensures more uniform heat transfer to the reaction container and wafer, improving temperature uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heating efficiency by reducing power consumption and improving temperature uniformity across wafers, ensuring better deposition processes in substrate processing.
Implementation Method 1
a heat compensating part on a lower surface of the upper wall heat insulator, the heat compensating part including a reflection surface in a first region on the lower surface of the upper wall heat insulator
Implementation Method 2
the reflection surface having a first emissivity less than an emissivity of the upper wall heat insulator
Data Source
AI summary
A heating apparatus including a side wall heat insulator configured to provide an inner space for receiving a reaction tube, an upper wall heat insulator covering a top portion of the side wall heat insulator, a heat generation part in an inner surface of the side wall heat insulator, and a heat compensating part on a lower surface of the upper wall heat insulator, the heat compensating part including a reflection surface in a first region on the lower surface of the upper wall heat insulator, the first region having a first emissivity less than an emissivity of the upper wall heat insulator may be provided.


