Heating Assembly Cooling with Heat Pipe Intermediary
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Solution Overview
Problem
Traditional cooling elements used in semiconductor processing chambers are ineffective for high-temperature or high-density heat sources, leading to inadequate temperature control and thermal management issues.
Innovation Solution
A heating assembly incorporating a heat exchange device with heat pipes that provides rapid and uniform cooling by positioning a hot interface in thermal contact with heating elements and a cold interface in contact with a cooling element, facilitating efficient heat transfer and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cooling elements are used for high-temperature heat sources, then the cooling system is simple in structure, but the cooling effectiveness is insufficient and temperature control is inadequate
Solution Approach 1:
A heat exchange device is introduced as an intermediary component between the heating elements and the cooling element. This heat exchange device includes a hot interface in thermal contact with the heating elements and a cold interface in thermal contact with the cooling element, enabling efficient heat transfer from high-temperature sources to the cooling system without direct contact between cooling fluid and heating elements.
Solution Approach 2:
The cooling system is segmented into distinct functional components: heating elements, heat exchange device with separate hot and cold interfaces, and cooling element with cooling channels. This segmentation allows each component to be optimized for its specific function while maintaining overall system effectiveness.
2Manufacturing precision
If cooling channels are directly integrated with heating elements, then the cooling system is compact, but thermal gradients and stress are increased
Solution Approach 1:
The heat exchange device serves as a mediator that decouples the heating elements from the cooling channels, allowing heat to be transferred efficiently while preventing direct thermal contact that would create thermal gradients and stress in the heating elements.
Solution Approach 2:
The heat exchange device provides localized heat transfer at its hot interface with the heating elements, while the cooling element with its cooling channels provides localized cooling. This distributed local quality approach ensures uniform temperature control across the heating assembly without creating concentrated thermal stress points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise temperature control, reduces thermal gradients and stress, and improves temperature uniformity, effectively addressing the limitations of traditional cooling methods for densely packed heating elements in semiconductor processing.
Implementation Method 1
a heat exchange device disposed between the plurality of heating elements and the cooling element. The heat exchange device includes a hot interface disposed adjacent to and in thermal contact with the plurality of heating elements and a cold interface disposed adjacent to and in thermal contact with the cooling element
Implementation Method 2
a cooling element having one or more cooling channels for receiving cooling fluid therein
Data Source
AI summary
Embodiments of the present invention provide a heating assembly using a heat exchange device to cool a plurality of heating element. The heating assembly includes a plurality of heating elements, a cooling element having one or more cooling channels for receiving cooling fluid therein, and a heat exchange device disposed between the plurality of heating elements and the cooling element. The heat exchange device comprises a hot interface disposed adjacent to and in thermal contact with the plurality of heating elements and a cold interface disposed adjacent to and in thermal contact with the cooling element.