Heating block for heating water
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The connection and triggering of semiconductor switches in heating blocks for continuous-flow heaters are complex and costly due to the need for direct contact with water and high currents, which also leads to unwanted heating and cooling challenges.
Innovation Solution
A heating block design where the semiconductor switch is directly connected to a closure piece and control board, eliminating the need for additional connection lines and using a heating coil fastening pin for thermal connection, allowing for a sandwich structure that simplifies installation and reduces costs by eliminating unnecessary components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor switch is directly connected to the closure piece for cooling, then the cooling efficiency is improved, but the connection complexity and cost increase
Solution Approach 1:
The semiconductor switch is merged with the closure piece by directly mounting the switch onto the closure piece, which serves as both a structural component and a heat dissipation element. This eliminates the need for separate cooling mechanisms and reduces the number of connection lines required.
Solution Approach 2:
The closure piece is designed to serve multiple functions: it provides structural closure for the heating block cavity and simultaneously acts as a heat sink for cooling the semiconductor switch. This multi-functionality reduces the overall component count and simplifies the system architecture.
2Reliability
If additional connection lines are used for the semiconductor switch, then the electrical connection is improved, but the device complexity and cost increase
Solution Approach 1:
The electrical connection function is merged into the closure piece structure itself. The closure piece incorporates contact elements that directly engage with the semiconductor switch, eliminating the need for separate connection lines while maintaining reliable electrical contact.
Solution Approach 2:
The function of separate connection lines is extracted and integrated into the closure piece. The closure piece now contains the necessary electrical contact structures, removing the need for additional external connection components.
3Power
If the semiconductor switch handles high currents for heating, then the heating power is improved, but the unwanted heating of the switch increases
Solution Approach 1:
The closure piece acts as an intermediary thermal management component between the semiconductor switch and the water. It provides a dedicated heat dissipation path that separates the high-current heating function from the switch, allowing the switch to handle high currents while the closure piece manages the resulting heat.
Solution Approach 2:
The unwanted heat generated by the semiconductor switch during high-current operation is converted into a beneficial cooling effect. The closure piece, being in contact with the water, transfers this heat to the water, which absorbs it and continues its heating process, thus converting a harmful thermal byproduct into useful heating energy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the connection of semiconductor switches, reduces costs, and enhances thermal conductivity by direct contact with the medium, improving the efficiency and reliability of the heating block.
Implementation Method 1
The semiconductor switch is thermally conductively connected to the closure piece by a first connection terminal such that an electrical connection of the first connection terminal to the heating element is carried out via the closure piece and a thermal connection of the first connection terminal to the medium is carried out via the closure piece
Implementation Method 2
at least one electric heating element for heating the medium is arranged in the cavity. The electric heating element is energized for this purpose by an electric current which results in heating of the heating element
Data Source
AI summary
A heating block including a heating block body which receives/guides a liquid medium, an electric heating element arranged in the cavity for heating the medium via electric current, a semiconductor switch for controlling the electric current flowing through the heating element to control a heating power of the heating element, and a closure piece for closing an opening in the heating block body to the cavity element. The semiconductor switch is electrically and thermally conductively connected to the closure piece via first connection terminal to electrically connect the first connection terminal to the heating element via the closure piece, and to thermally connect the first connection terminal to the medium via the closure piece. The semiconductor switch is directly connected to a control board by a second connection terminal so that the semiconductor switch is spatially arranged and mechanically connected directly between the control board and the connection piece.