Heating Block Thermal Resistance Simulation for Test Die Accuracy
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Solution Overview
Problem
The existing thermal performance testing methods using a heating block with uniform heating performance fail to accurately represent the thermal resistance of a thermal test die, leading to unreliable testing results due to variations in environmental temperature, contact pressure, and heating power, which affects the quality of thermal management modules in mass production.
Innovation Solution
A method is developed to simulate the thermal resistance value of a thermal test die by establishing a corresponding relationship between the size of a heating block and its thermal resistance using numerical analysis, determining the size of the heating block through regression analysis and setting target values to ensure the reliability of testing results.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a heating block with uniform heating performance is used to substitute the thermal test die, then the heating block can be easily manufactured and used for thermal performance testing, but the thermal resistance value of the heating block differs from that of the thermal test die, leading to inaccurate testing results
Solution Approach 1:
The patent applies parameter changes by adjusting the size parameters (length, width, height) of the heating block to match the thermal resistance characteristics of the thermal test die. By establishing a correspondence relationship between the dimensions of the heating block and its thermal resistance value, the invention enables the heating block to simulate the thermal properties of the test die accurately, thereby resolving the contradiction between ease of manufacture and measurement precision.
2Device complexity
If the heating block size is fixed, then the manufacturing process is simplified, but the thermal resistance of the heating block cannot precisely represent the thermal resistance of the thermal test die under varying conditions
Solution Approach 1:
The patent establishes a correspondence relationship between the size parameters of the heating block and its thermal resistance value. This allows the heating block to be designed with specific dimensions that match the thermal resistance characteristics of the thermal test die, thereby improving reliability while maintaining relatively simple device structure.
Solution Approach 2:
The invention creates a simplified copy (heating block) that replicates the essential thermal resistance characteristics of the complex thermal test die. By copying only the critical thermal properties through carefully selected dimensions, the patent achieves reliable thermal performance testing without requiring the full complexity of the original test die.
3Productivity
If thermal performance testing is conducted without verifying the relationship between transient and steady-state response values, then the testing process is faster, but the reliability of the testing results cannot be ensured
Solution Approach 1:
The patent implements a verification mechanism that compares the transient response value of the heating block with the steady-state response value of the thermal test die. This feedback process ensures that the heating block accurately represents the thermal test die before proceeding with mass production testing, thereby guaranteeing result reliability while maintaining efficient productivity through the established correspondence relationship.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the reliability of thermal performance testing by verifying the relationship between the transient and steady-state thermal resistance values of the heating block and the test die, ensuring the thermal management modules meet design specifications and reducing testing time, thereby enhancing product quality.
Implementation Method 1
a heating block having a uniform heating performance is generally used for substituting the thermal test die. The heating block is copper block having the uniform heating performance.
Data Source
AI summary
A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation.