Heating system component for sensing a first and second temperature
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Solution Overview
Problem
Existing heating system components face challenges in monitoring the temperature of both the heating unit and the medium efficiently due to bulky temperature sensors, which limits flexibility and accuracy, especially when both temperatures need to be monitored simultaneously.
Innovation Solution
A compact heating system component featuring a heat conducting plate assembly with separate heat capturing and releasing plate portions thermally coupled to both the heating unit and the medium, combined with a printed circuit board having distinct sensor areas for precise temperature measurement, allowing for flexible installation and improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bulky temperature sensors are used to monitor temperature, then temperature monitoring capability is provided, but flexibility in positioning and coupling is reduced
Solution Approach 1:
The temperature sensor is divided into two separate sensing areas (first sensor area and second sensor area) that can independently sense temperatures at different locations. This segmentation allows each sensor area to be positioned optimally for its specific measurement purpose, thereby improving flexibility while maintaining reliable temperature monitoring capability.
Solution Approach 2:
The patent transitions from using a single bulky three-dimensional temperature sensor to a planar two-dimensional sensor structure integrated into a printed circuit board. This dimensional change from 3D to 2D significantly reduces the space required and enables flexible positioning and coupling in various orientations without compromising temperature monitoring reliability.
2Measurement precision
If both medium temperature and heating unit temperature are monitored separately, then comprehensive temperature control is achieved, but device complexity increases
Solution Approach 1:
Two separate temperature sensing functions (medium temperature monitoring and heating unit temperature monitoring) are merged into a single integrated temperature sensor structure with two sensor areas on one printed circuit board. This consolidation achieves comprehensive temperature control while reducing device complexity by eliminating the need for two separate sensor assemblies and their associated mounting hardware.
Solution Approach 2:
The single temperature sensor structure serves multiple functions simultaneously: the first sensor area monitors medium temperature while the second sensor area monitors heating unit temperature. This multi-functionality allows comprehensive temperature control to be achieved with a single device, thereby reducing overall system complexity.
3Adaptability or versatility
If compact design is implemented, then flexibility and installation location options increase, but thermal decoupling risks may increase
Solution Approach 1:
A heat conducting plate assembly is introduced as an intermediary component between the heating unit and the sensor areas. This plate ensures reliable thermal coupling and accurate temperature transmission from both the medium and heating unit to the respective sensor areas, thereby maintaining measurement reliability while enabling a compact design that offers flexibility in installation locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances flexibility and accuracy in temperature monitoring, enabling precise control of the medium temperature while maintaining a compact design, reducing thermal decoupling risks and improving the lifespan of the system.
Implementation Method 1
a heat conducting plate assembly, wherein the heat conducting plate assembly comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit
Implementation Method 2
at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area
Data Source
Figure 1A~1C
Figure 2
Figure 3
AI summary
The present invention relates to A heating system component (18), comprising a carrier unit (26) having a dry side (38), a wet side (40), a groove (34) provided on the dry side (38), and a medium leading section (42) at least partially opposite a medium flow area on the wet side (40); a heating unit (28) at least partially received in the groove (34); a heat conducting plate assembly (46) that comprises a first heat capturing plate portion (54) that is thermally coupled to the heating unit (28), a second heat capturing plate portion (56) that is thermally coupled to the medium leading section (42) of the carrier unit (26), a first heat releasing plate portion (58), and a second heat releasing plate portion (60); at least one printed circuit board (48) comprising circuitry (70) with a first sensor area (72) and a second sensor area (74), wherein the circuitry (70) is configured to sense a first temperature at the first sensor area (72) and a second temperature at the second sensor area (74); a housing (50) accommodating at least a part of the printed circuit board (48) and at least a part of the heat conducting plate assembly (46) in such a way that the first sensor area (72) is thermally coupled to the first heat releasing plate portion (58) and the second sensor area (74) is thermally coupled to the second heat releasing plate portion (60).