Heating Component PCB Sensing for Medium and Heater Temperature
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Solution Overview
Problem
Existing heating system components face challenges in monitoring the temperature of both the medium and the heating unit due to bulky temperature sensors, which limits flexibility and accuracy in temperature measurement.
Innovation Solution
A compact heating system component design featuring a heat conducting plate assembly with separate heat capturing and releasing plate portions, thermally coupled to both the heating unit and the medium, and integrated with a printed circuit board for precise temperature sensing, allowing for flexible installation and improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If bulky temperature sensors are used to monitor temperature, then temperature monitoring capability is provided, but flexibility in positioning and coupling is reduced
Solution Approach 1:
The temperature sensor is segmented into two separate sensing elements: a first temperature sensing element in thermal contact with the heating unit and a second temperature sensing element in thermal contact with the medium. This segmentation allows each sensing element to be independently positioned and coupled, providing flexibility while maintaining temperature monitoring capability.
Solution Approach 2:
Thermal coupling elements are introduced as intermediaries between the temperature sensing elements and the objects being measured (heating unit and medium). These thermal coupling elements facilitate heat transfer while allowing flexible positioning and arrangement of the sensing elements relative to the heating unit and medium.
2Measurement precision
If both medium temperature and heating unit temperature are monitored, then comprehensive temperature monitoring is achieved, but device complexity increases
Solution Approach 1:
The first and second temperature sensing elements are integrated into a single temperature sensor assembly that is thermally coupled to both the heating unit and the medium. This merging approach allows comprehensive temperature monitoring while reducing overall device complexity compared to using separate bulk sensors for each measurement.
Solution Approach 2:
The temperature sensor is designed as a multi-functional device that simultaneously performs two temperature measurements: one for the heating unit and another for the medium. This universal design eliminates the need for separate sensors and reduces system complexity while achieving comprehensive monitoring.
3Adaptability or versatility
If compact design is implemented, then flexibility and integration are improved, but thermal coupling effectiveness may be reduced
Solution Approach 1:
The compact temperature sensor employs local thermal coupling zones where the first sensing element is positioned in close thermal contact with the heating unit and the second sensing element is positioned in close thermal contact with the medium. This local quality approach ensures effective thermal coupling at each measurement point while maintaining overall compact dimensions.
Solution Approach 2:
Thermal coupling elements serve as intermediaries that maintain effective thermal contact between the sensing elements and the measurement targets (heating unit and medium) even within the compact sensor structure. These intermediaries ensure reliable heat transfer while allowing the sensor to maintain a compact integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise and flexible temperature monitoring of both the medium and the heating unit, enhancing the accuracy and flexibility of temperature measurements while maintaining a compact design.
Implementation Method 1
a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion
Data Source
AI summary
The present invention relates to a heating system component, comprising a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side; a heating unit at least partially received in the groove; a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion; at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area; a housing accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in such a way that the first sensor area is thermally coupled to the first heat releasing plate portion and the second sensor area is thermally coupled to the second heat releasing plate portion.