Heating-Cooling Module with Isolated Thermal Paths

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Solution Overview

Problem

The challenge is to design a heating-cooling module for thinner and smaller electronic components that ensures compatibility with operating conditions, particularly in portable and wearable devices, where traditional designs may compromise heat dissipation and heating efficiency due to size constraints.

Innovation Solution

A heating-cooling module is proposed, comprising a heat-dissipation element, a first thermal conductive layer, a heater, and a second thermal conductive layer, with a heat isolation layer, all arranged on the same side of the electronic component to enhance heat exchange and prevent thermal paths from interfering with each other, while maintaining a compact design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the electronic product is designed to be thinner and smaller, then the portability and convenience are improved, but the heat dissipation and heating efficiency deteriorate

Engineering Contradiction:

Improvesize of electronic productVSAvoidheat dissipation efficiency

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent divides the thermal management system into separate heating and cooling modules, each with dedicated thermal conductive layers. The heating module includes a heater and second thermal conductive layer, while the cooling module includes a heat dissipation element and first thermal conductive layer. This segmentation allows independent optimization of heating and cooling paths, ensuring efficient thermal management despite the compact size of the electronic product.

Inventive Principle:

Principle #1Segmentation

2Area of stationary object

If the heating and heat dissipation elements are arranged on the same side of the electronic component, then the space usage is improved, but the thermal interference between heating and cooling paths may occur

Engineering Contradiction:

Improvespace utilization on component surfaceVSAvoidthermal interference

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent introduces heat isolation layers as intermediary elements between the heating and cooling modules. The heat isolation layer is arranged between the heater and the heat dissipation element, preventing direct thermal coupling. This intermediary structure allows both heating and cooling elements to be positioned on the same side of the electronic component for space efficiency, while the heat isolation layer blocks harmful thermal interference between the two paths.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the thermal conductive layers are separated from each other, then the thermal path independence is improved, but the structural complexity increases

Engineering Contradiction:

Improvethermal path independenceVSAvoidstructure of heating-cooling module

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat isolation layer serves multiple functions simultaneously: it isolates heat between the heating and cooling paths, provides structural support for positioning the thermal conductive layers, and helps maintain the compact arrangement of components. This multi-functionality reduces the need for additional separate isolation structures, thereby limiting the increase in structural complexity while ensuring thermal path independence.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively integrates heat dissipation and heating functions on the same side of the electronic component, increasing space usage and preventing thermal interference, thus optimizing the module's thinness and smallness while maintaining efficient heat management.

Implementation Method 1

The first thermal conductive layer is arranged between the electronic component and the heat-dissipation element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The second thermal conductive layer is arranged between the electronic component and the heater

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The heat-dissipation element is arranged over the electronic component

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Implementation Method 4

The heater is arranged over the electronic component

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS10504812B1Heating-cooling module

Publication Date: 2019.12.10 CHICONY ELECTRONICS CO LTD

AI summary

A heating-cooling module is disposed on an electronic component and includes a heat-dissipation element, a first thermal conductive layer, a heater, and a second thermal conductive layer. The heat-dissipation element is arranged over the electronic component. The first thermal conductive layer is arranged between the electronic component and the heat-dissipation element. The heater is arranged over the electronic component, in which the heater and the heat-dissipation element are located above the same side of the electronic component, and the heater and the heat-dissipation element are separated from each other. The second thermal conductive layer is arranged between the electronic component and the heater and is separated from the first thermal conductive layer.