Heating Cost Allocator With Flexible Sensor Interconnects

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Solution Overview

Problem

The existing heating cost distributors with a temperature sensor arm integrated into the electronic card are costly and inflexible, requiring complex manufacturing processes and limited to bending angles of around 90 degrees due to the arm's thickness constraints.

Innovation Solution

A heating cost distributor design featuring a main electronic board with flexible surface-mount interconnection sheets connected to temperature sensors, allowing for greater flexibility and easier manufacturing, with optional metallic or thermally conductive components for improved thermal conductivity and secure attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the second temperature sensor is fixed to the end of a flexible arm produced in one piece with the electronic card, then the manufacturing is integrated, but the manufacture becomes complex and costly due to requiring specific molding processes or subsequent machining to reduce thickness

Engineering Contradiction:
Improvemanufacturing complexityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent divides the integrated arm structure into separate components: the electronic card and the flexible arm are manufactured independently and then assembled. This segmentation allows each component to be optimized for its specific manufacturing requirements, avoiding the need for complex integrated molding processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flexible arm is positioned within a groove of the adapter, creating a nested arrangement where the arm fits into the adapter structure. This nesting approach simplifies assembly while maintaining the integrated functionality of the sensor assembly.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If the flexible arm is made in one piece with the electronic card, then structural integration is achieved, but the flexibility is reduced and cannot be bent at large angles of the order of 90 degrees

Engineering Contradiction:
ImproveflexibilityVSAvoidstructural integration
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

By separating the flexible arm from the electronic card into distinct components, the arm can be designed with optimal flexibility characteristics without being constrained by the rigidity requirements of the card structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The flexible arm is designed as a thin, flexible component that can be bent at large angles. Its thin profile and flexible material properties enable it to achieve bending angles of approximately 90 degrees while maintaining structural integrity.

Inventive Principle:
Principle #30Flexible shells and thin films

3Adaptability or versatility

If the arm is made thinner to increase flexibility, then bending capability improves, but manufacturing complexity increases due to requiring specific molding processes or subsequent machining

Engineering Contradiction:
Improvebending capabilityVSAvoidmanufacturing simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The arm is manufactured as a separate component with standard thickness, avoiding the need for complex thin-walled molding or machining operations that would be required if the arm were integrated into the card.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The arm's flexibility is achieved through material selection and geometric design parameters rather than extreme thinning. This allows the arm to maintain adequate thickness for easy manufacturing while still achieving the required bending capability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces manufacturing complexity and costs while enhancing the flexibility of the temperature sensor arm, enabling easier installation and improved thermal conductivity, thus addressing the limitations of existing designs.

Implementation Method 1

an electronic card, called main board (3), carries at least one flexible surface-mount interconnection sheet (7, 8) connected to said main electronic board (3) and to an electronic support board (9, 10) of one of said sensors

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

said electronic support card for said sensor intended for measuring the temperature of said heating element comprises a metallic coating

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

said electronic support card for said sensor intended for measuring the temperature of said heating element and said thermal conductive element being sandwiched between two flanges secured to said adapter

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2541157B1Heating cost distributor
Publication Date: 2014.01.22 ITRON FRANCE
  • EP2541157B1 patent drawingFigure 1A~1B
  • EP2541157B1 patent drawingFigure 2A~2B
  • EP2541157B1 patent drawingFigure 3

AI summary

The invention relates to a heat cost allocator intended to be fixed to a heating element and comprising, within a housing (1) mounted on a rear adapter (2), an electronic board (3) referred to as the main board connected to a first temperature sensor (4) for measuring the external temperature and located near said housing (1), and to a second temperature sensor (6) for measuring the temperature of said heating element and located near said adapter (2). According to the invention, said main electronic board (3) carries at least one flexible surface-mount interconnect cable (7, 8) connected to said main electronic board (3) and to a support electronic board (8, 9) for one of said sensors (4, 6).