Heating Device Center-Cool Temperature Distribution
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Solution Overview
Problem
The existing heating devices for semiconductor manufacturing suffer from degraded temperature control properties, leading to uneven film thickness during CVD processes due to center-cool temperature distributions, and excessive heat buildup in the hollow shaft, which degrades the sealing properties of the O-ring.
Innovation Solution
A heating device with a disk-shaped ceramic base and a hollow shaft where the density of heating is higher in the central portion than the peripheral portion, and the hollow shaft has a thicker first section to dissipate heat efficiently, preventing excessive temperature increase at the lower end.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the density of heating is reduced in the central portion to achieve center-cool temperature distribution, then the center-cool temperature distribution is improved, but the temperature control property is degraded
Solution Approach 1:
The heating element is designed with non-uniform heating density across different regions of the ceramic base. Specifically, the central portion has lower heating density while the peripheral portion has higher heating density, creating a center-cool temperature distribution that prevents central overheating during CVD processes
Solution Approach 2:
A thermocouple is positioned to measure temperature at the central portion of the ceramic base, providing feedback to the control system. The control system adjusts power supply to the heating element based on this temperature feedback, maintaining stable temperature control despite the non-uniform heating density distribution
2Reliability
If the density of heating is increased in the central portion to improve temperature control property, then the temperature control property is improved, but the central portion temperature becomes excessively high
Solution Approach 1:
The heating element is designed with non-uniform heating density across different regions of the ceramic base. Specifically, the central portion has lower heating density while the peripheral portion has higher heating density, creating a center-cool temperature distribution that prevents central overheating during CVD processes
Solution Approach 2:
A thermocouple is positioned to measure temperature at the central portion of the ceramic base, providing feedback to the control system. The control system adjusts power supply to the heating element based on this temperature feedback, maintaining stable temperature control despite the non-uniform heating density distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves stable center-cool temperature distribution and improved temperature control, preventing excessive heat buildup in the hollow shaft and maintaining the sealing integrity of the O-ring.
Implementation Method 1
a resistance heating element disposed inside or on the surface of the ceramic base
Implementation Method 2
the temperature of the ceramic base is measured using a thermocouple
Data Source
AI summary
A heating device 10 includes a ceramic base 20, a resistance heating element 22, and a hollow shaft 40. The ceramic base 20 includes a central portion 20a and a peripheral portion 20b. The resistance heating element 22 is designed in such a manner that the density of heating in the central portion 20a is 1.4 to 2.0 times that in the peripheral portion 20b. The hollow shaft 40 includes a first section 41 and a second section 42. The thickness tb1 of the first section 41 is 6 to 10 mm. The thickness tb2 of the second section 42 is 0.3 to 0.5 times the thickness tb1 of the first section 41. The length of the first section 41 is 0.4 to 0/8 times the overall length of the hollow shaft 40.