Heating Device Central Cooling Channel Wafer Temperature Control
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Solution Overview
Problem
Existing heating devices face challenges in creating a temperature difference between the central and outer portions of a substrate placement surface without increasing the number of heating resistors, especially as device sizes decrease, limiting the insertion of wires and wires' expansion/contraction issues.
Innovation Solution
A heating device design featuring a base body with embedded heating resistors, a cylindrical supporting body with channels for fluid flow, and a base-body channel connecting these channels, allowing for efficient cooling of the central portion without additional resistors, and incorporating a ring-shaped base-body channel to facilitate wire arrangement and cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple heating resistors are provided to create temperature difference between central and outer portions, then temperature control flexibility is improved, but device complexity increases and wire insertion becomes difficult
Solution Approach 1:
The patent applies local quality by providing a cooling channel specifically at the central portion of the base body where temperature reduction is needed. Instead of uniformly distributing cooling or heating elements across the entire base body, the cooling channel is localized to the central region to create the desired temperature difference between central and outer portions.
Solution Approach 2:
The patent inverts the conventional approach by using cooling rather than heating to achieve temperature difference control. Instead of adding multiple heating resistors to create temperature variations, the invention introduces a cooling channel that selectively cools the central portion, thereby creating temperature difference through cooling rather than heating.
2Volume of moving object
If device size is reduced, then productivity and compactness are improved, but the ability to insert multiple wires and heating resistors deteriorates
Solution Approach 1:
The patent extracts the temperature control function from multiple heating resistors and concentrates it into a single cooling channel system. By removing the need for multiple heating resistors and their associated wiring, the design achieves temperature difference control with minimal wire insertion requirements, suitable for compact devices.
Solution Approach 2:
The cooling channel serves multiple functions: it cools the central portion of the base body, creates temperature difference between central and outer portions, and eliminates the need for multiple heating resistors. This multi-functional approach allows compact device design without sacrificing temperature control capability.
3Reliability
If wire is inserted in cylindrical supporting body for heating resistor connection, then electrical connection is achieved, but wire expansion and contraction causes cracking
Solution Approach 1:
The patent applies local quality by providing a cooling channel specifically at the central portion of the base body where temperature reduction is needed. Instead of uniformly distributing cooling or heating elements across the entire base body, the cooling channel is localized to the central region to create the desired temperature difference between central and outer portions.
Solution Approach 2:
The patent inverts the conventional approach by using cooling rather than heating to achieve temperature difference control. Instead of adding multiple heating resistors to create temperature variations, the invention introduces a cooling channel that selectively cools the central portion, thereby creating temperature difference through cooling rather than heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables adjustable temperature differences between the central and outer portions of the substrate placement surface without increasing heating resistor count, while suppressing wire expansion and contraction, thus preventing cracking and improving cooling efficiency.
Implementation Method 1
a heating resistor that is embedded in the base body
Implementation Method 2
when a fluid is made to flow via two supporting-body channels, that is, a first supporting-body channel and a second supporting-body channel, which extend in a direction from the other end surface to the one end surface, and via a base-body channel, which connects the first supporting-body channel and the second supporting-body channel, it is possible to cool only a central portion of the base body
Data Source
AI summary
A heating device includes a base body 2 that has a placement surface 2a for placing a wafer W thereon; a heating resistor 4 that is embedded in the base body 2; a cylindrical supporting body 3 that has one end surface 3a that is connected to a back surface 2b of the base body 2 that is on an opposite side of the placement surface 2a, the one end surface 3a having an open end; at least two supporting-body channels 5, 6 that are formed within a peripheral wall of the cylindrical supporting body 3; and a base-body channel 7 that is provided at only a portion of the base body 2 at an immediately overhead region of the cylindrical supporting body 3, and that extends through the base body 2 and connects the at least two supporting-body channels 5, 6 to each other.