Heating Device Fluid Channel Temperature Gradient
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Solution Overview
Problem
Existing heating devices face challenges in creating a temperature difference between the central and outer portions of a substrate placement surface without increasing the number of heating resistors, particularly as device sizes are reduced, limiting the insertion of multiple heating resistors into a cylindrical supporting body.
Innovation Solution
A heating device design that includes a base body with a heating resistor and a cylindrical supporting body featuring a channel that allows fluid to pass through, creating a temperature difference between the central and outer portions without additional heating resistors, by using a supporting-body channel with an opening portion connecting to the base body's back surface, which can be easily integrated into existing designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple heating resistors are provided to create temperature difference, then temperature control flexibility is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by creating a temperature difference between the central portion and outer portion of the base body through localized fluid cooling. The fluid passage is positioned to cool specific regions, allowing different temperature zones without adding multiple heating resistors. This resolves the contradiction by achieving temperature control flexibility through spatially differentiated cooling rather than multiple heating elements.
Solution Approach 2:
The patent uses fluid (gas or liquid) flowing through a passage in the cylindrical supporting body to achieve temperature control. The fluid absorbs heat from the base body, creating temperature differences between regions. This hydraulic/pneumatic approach replaces the need for multiple heating resistors, reducing device complexity while maintaining temperature control flexibility.
2Volume of moving object
If device size is reduced, then compactness is improved, but the ability to insert multiple heating resistors deteriorates
Solution Approach 1:
Instead of using multiple heating resistors to create temperature differences, the patent inverts the approach by using a single heating resistor combined with localized fluid cooling. The cooling action creates the temperature differentiation, allowing compact device design without sacrificing temperature control capability. This inversion resolves the contradiction between compactness and adaptability.
Solution Approach 2:
The cylindrical supporting body serves multiple functions: it provides structural support, contains the fluid passage for cooling, and facilitates temperature control. This multi-functionality allows the device to maintain temperature control versatility in a compact form factor, resolving the contradiction between device size and adaptability.
3Adaptability or versatility
If fluid cooling channel is added to cylindrical supporting body, then temperature difference control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the fluid passage with the cylindrical supporting body structure itself. The passage is formed within the supporting body, combining two components into one. This integration improves temperature difference control while minimizing manufacturing complexity by reducing the number of separate parts and assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for adjustable temperature differences between the central and outer portions of the placement surface without increasing the number of heating resistors, enhancing cooling efficiency and manufacturing ease by utilizing fluid flow through the supporting-body channel.
Implementation Method 1
a heating resistor that is embedded in the base body
Implementation Method 2
a central portion of the back surface of the base body can be cooled by a fluid that passes through the supporting-body channel
Data Source
AI summary
A heating device includes a base body that has a placement surface for placing a wafer thereon and a back surface that is on an opposite side of the placement surface; a heating resistor that is embedded in the base body; a cylindrical supporting body that has one end surface and the other end surface, the one end surface being connected to the back surface of the base body, the other end surface being on an opposite side of the one end surface; and a supporting-body channel that includes a portion extending in a direction from the other end surface to the one end surface of the cylindrical supporting body, and that is formed within a peripheral wall of the cylindrical supporting body. The supporting-body channel includes an opening portion that opens inwardly from an outer peripheral surface of the cylindrical supporting body.