Heating Device for Integrated Components with Moveable Contacts
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Solution Overview
Problem
Existing heating devices for testing integrated components face issues with reliable temperature compliance and accurate electrical parameter measurement due to contact problems and temperature deviations, leading to inefficient and costly troubleshooting.
Innovation Solution
A heating device with an inner casing and heating element arrangement featuring moveable electrically conductive contact devices and a positioning system that ensures secure mechanical and electrical contact, combined with a thermally insulating design for uniform temperature distribution, reducing the number of electrical contacts and eliminating the need for printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If printed circuit boards and multiple electrical contacts are used to establish electrical connections between test specimen and loading/measuring electronics, then electrical connectivity is achieved, but contact problems and temperature deviations occur leading to unreliable data
Solution Approach 1:
The patent extracts and eliminates the printed circuit board from the hot region, removing the source of contact problems. Electrical connections are established directly through the oven wall using simple contact devices, eliminating the complex PCB-based connection system that caused reliability issues.
Solution Approach 2:
The patent introduces an intermediary approach by using contact devices that pass through the oven wall to establish electrical connections. These contact devices serve as mediators between the test specimen in the hot region and the loading/measuring electronics outside, eliminating the need for complex PCB traces in the thermal environment.
2Temperature
If multiple electrical contacts and printed circuit boards are used in the heating device, then electrical connectivity is established, but temperature homogeneity deteriorates due to heat generation and thermal deviations
Solution Approach 1:
The patent removes the printed circuit board from the hot region, eliminating the heat generation source that caused temperature deviations. This extraction improves temperature homogeneity by reducing thermal interference from the electrical connection system.
Solution Approach 2:
The contact devices act as thermal intermediaries that minimize heat transfer into the hot region. By designing these contact devices to have minimal thermal mass and conducting heat only where necessary, the patent maintains temperature homogeneity while establishing electrical connectivity.
3Productivity
If complex electrical connection systems with printed circuit boards are used, then electrical connectivity is achieved, but troubleshooting time increases due to contact problems and temperature deviations
Solution Approach 1:
The patent extracts the source of troubleshooting problems by removing the printed circuit board from the hot region. This eliminates contact problems and temperature deviations that required extensive troubleshooting, thereby improving productivity.
Solution Approach 2:
The simplified contact device system is designed to be self-verifying and self-adjusting, eliminating the need for complex troubleshooting procedures. The system automatically establishes reliable electrical connections without requiring extensive engineering intervention for debugging.
4Ease of repair
If conventional heating devices with printed circuit boards are used, then electrical connections are established, but maintenance costs increase due to contact problems and system failures
Solution Approach 1:
The patent removes the printed circuit board from the thermal environment, eliminating the primary source of maintenance problems. This simplification reduces maintenance costs while improving system reliability.
Solution Approach 2:
The contact devices are designed as simple, replaceable components that can be easily replaced if needed, rather than complex PCB traces that require sophisticated repair. This approach reduces maintenance costs and improves ease of repair.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a fault-free heating device with improved temperature homogeneity, reduced maintenance costs, and increased efficiency, allowing for precise testing conditions and minimizing engineer time spent on troubleshooting.
Implementation Method 1
The heating device typically generates the heat from current, for example using heating wires or heating lamps
Implementation Method 2
combined with a thermally insulating design for uniform temperature distribution
Data Source
AI summary
A heating device for testing integrated components is disclosed. In one embodiment, an inner casing is arranged in the heating device surrounding a holding chamber. The inner casing contains at least one recess in which an electrically conductive contact device is moveably arranged. This permits contact to be reliably made with a circuit to be tested. If the inner casing is of compact design, there is a very homogeneous temperature distribution in the heating device.