Heating Device Thermal Stress Management via Segmented Receiving Holes
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Solution Overview
Problem
Conventional heating devices in biochemical reactors suffer from shortened lifetimes and reduced production yields due to easily cracked tin soldering connections and potential short-circuits caused by molten tin penetration into closed spaces during the welding process.
Innovation Solution
A heating device design featuring an upper, middle, and lower plate with conductive layers and receiving tubes, which allows for elastic deformation to absorb thermal stress and prevents short-circuits by maintaining the receiving through hole as an open space, reducing the likelihood of molten tin penetration and connection between terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tin soldering is used to connect heating element terminals to conductive layers, then electrical connection is achieved, but the connection cracks easily due to thermal stress from repeated expansions and contractions
Solution Approach 1:
The patent changes the connection method from tin soldering to direct welding, fundamentally altering the joining parameter to eliminate thermal stress cracking. This parameter change transforms the connection from a soldered joint susceptible to thermal fatigue into a welded joint with superior stress resistance and longevity.
2Strength
If the receiving space is closed during welding, then structural integrity is maintained, but molten tin penetrates into the space causing short-circuits between terminals
Solution Approach 1:
The patent segments the receiving space into multiple independent cavities, each accommodating a separate heating element terminal. This segmentation prevents molten tin from traveling between terminals through the space, eliminating the short-circuit risk while preserving overall structural integrity through the multi-cavity design.
3Ease of manufacture
If vacuum suction is applied during welding, then molten tin is drawn into the receiving space, but this creates short-circuit paths between terminals
Solution Approach 1:
The patent divides the receiving space into separate cavities for each terminal, so that even if vacuum suction draws molten tin into the space, the segmented structure prevents tin from forming continuous paths between terminals. This segmentation maintains electrical insulation reliability while allowing the welding process to proceed with vacuum suction control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the longevity and production yield of heating devices and biochemical reactors by maintaining steady vessel temperatures and preventing short-circuits, ensuring uniform heating efficiency and prolonged device lifespan.
Implementation Method 1
the heating element can convert the electrical energy into heat energy to heat the vessel
Implementation Method 2
Upper and lower terminals of the heating element are respectively connected electrically to the two conductive layers by respective tin soldering
Implementation Method 3
a part of molten tin soldering may penetrate into a space between the heating element and a wall of the receiving hole by capillary action
Data Source
AI summary
The present disclosure relates to a heating device and a biochemical reactor having the heating device. The heating device includes an upper plate, a lower plate, a middle plate, and an electric heating element. The upper plate has an upper heating hole, an upper receiving hole, and an upper conductive layer. The lower plate has a lower heating hole, a lower receiving hole, and a first lower conductive layer. The middle plate is disposed between the upper and lower plates and has a middle heating hole and a middle receiving hole. The upper, middle and lower receiving holes are connected together to form a receiving through hole. The electric heating element is disposed in the receiving through hole and has two terminals connected to the upper conductive layer and the lower conductive layer, respectively.