Heating Device Trapezoidal Electrode Crack Resistance
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Solution Overview
Problem
The existing heating devices for semiconductor manufacturing suffer from cracks in the dielectric material layer between the high-frequency electrode and the ceramics base due to thrust forces and thermal expansion, leading to reduced reliability and shorter lifespan.
Innovation Solution
A heating device with a trapezoidal cone-like concave section on the high-frequency electrode at the region opposed to the conducting hole, which increases the strength of the dielectric material layer and reduces the risk of cracks by uniformly distributing loads and thermal stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat high-frequency electrode is used in the ceramics base, then the plasma distribution is uniform, but the dielectric material layer is weak and prone to cracks under thrust and thermal stress
Solution Approach 1:
The high-frequency electrode is designed with a concave section at the specific location opposite the power feeding material insertion hole, while maintaining a flat surface elsewhere. This local modification concentrates structural reinforcement where the thrust force is applied, preventing cracks in the dielectric material layer without affecting the overall plasma distribution uniformity.
Solution Approach 2:
The concave section is pre-formed in the high-frequency electrode before assembly into the ceramics base. This preliminary structural preparation ensures that when the power feeding material is inserted and thermal cycling occurs, the dielectric material layer is already supported by the reinforced concave structure, preventing crack formation during operation.
2Volume of moving object
If the dielectric material layer thickness is reduced to maintain compact design, then the device size is smaller, but the layer becomes weaker and more susceptible to cracking
Solution Approach 1:
Instead of uniformly increasing the dielectric material layer thickness throughout the entire electrode, the concave section provides localized reinforcement only at the critical area opposite the power feeding material insertion hole. This allows the device to maintain a compact overall size while strengthening the specific region prone to cracking.
Solution Approach 2:
The electrode structure is segmented into a flat surface region for plasma generation and a concave section for mechanical reinforcement. This segmentation allows the dielectric material layer to be thin in most areas (maintaining compact size) while being effectively supported in the critical region (preventing cracks).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses crack generation and maintains high reliability and long-term performance by enhancing the strength of the dielectric material layer and ensuring uniform plasma distribution.
Implementation Method 1
a high-frequency electrode for causing this plasma atmosphere is provided in the vicinity of a heating surface of a ceramics base
Implementation Method 2
a resistance heating element is embedded in a disk-like ceramics base on which a wafer as a to-be-heated object is placed and is heated
Data Source
AI summary
A heating device includes a high-frequency electrode embedded substantially in parallel with a heating surface of a ceramics base in the vicinity of the heating surface. A conducting hole toward this high-frequency electrode is formed in a back face of the ceramics base. This high-frequency electrode has a trapezoidal cone-like concave section toward the conducting hole at a region opposed to the conducting hole.