Heating Element Circuit Module Stack Structure Cold Environment
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Solution Overview
Problem
Existing heating solutions for electronic components in computers, such as heat insulating materials and resistance heating circuits, are costly, complex to manufacture, and inefficient in maintaining optimal temperatures in extreme cold environments, especially when the computer design prioritizes lightness and compactness.
Innovation Solution
A heating element and circuit module stack structure that includes a heat sink with a thermally conductive base, a heat transfer layer, an electric heating element, and a thermal insulation component, which automatically activates when the temperature drops below 0°C and deactivates when it reaches the normal operating range, ensuring efficient and uniform heating of the chip unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat insulating materials are used to protect internal electronic components against outside cold air, then the components are protected from cold, but the computer design requirements for light, thin, short and small characteristics cannot be met
Solution Approach 1:
The patent extracts the heating function from a separate heating module and integrates it directly into the heat sink structure. The heating element is embedded within the heat sink's thermal conduction path, eliminating the need for separate insulating materials and complex module installations while maintaining protection and heating functions
Solution Approach 2:
The patent merges the heating function with the heat dissipation function by integrating the heating element directly into the heat sink structure. This combination allows the same component to serve dual purposes: dissipating heat during normal operation and generating heat during cold conditions, eliminating the need for separate insulating materials
2Reliability
If a heating layer is installed in the circuit board between insulating layers, then electronic components are heated to normal operating temperature range, but the installation becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent extracts the heating function from the circuit board structure and relocates it to the heat sink assembly. This allows the heating element to be installed as a complete module rather than requiring complex integration between circuit board layers, significantly simplifying the manufacturing process
Solution Approach 2:
The patent uses the heat sink as an intermediary structure to deliver heating to the components. Instead of installing heating elements directly in the circuit board, the heat sink serves as a mediator that transfers heat from the heating element to the components through thermal conduction, simplifying installation while maintaining heating effectiveness
3Reliability
If MOSFETs are mounted at the surface of the circuit board for heating, then heat is generated to maintain operating temperature, but the spatial arrangement is complicated and heating uniformity is poor
Solution Approach 1:
The patent replaces the complex MOSFET-based active heating control system with a simpler resistive heating element that relies on thermal conduction through the heat sink structure. This substitution eliminates the need for complex spatial arrangement of MOSFETs and control circuits while achieving uniform heat distribution through the inherent thermal conduction properties of the heat sink
4Reliability
If MOSFETs are used with dynamic resistance controller, then heating control is achieved, but the cost of the heating module greatly increases
Solution Approach 1:
The patent replaces expensive MOSFETs and dynamic resistance controllers with a simple resistive heating element that uses the existing power supply circuitry. This substitution dramatically reduces component costs while maintaining adequate heating control through the thermal mass of the heat sink and simple on/off control based on temperature sensing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains optimal operating temperatures in cold environments without the drawbacks of traditional heating methods, enhancing spatial arrangement and reducing manufacturing costs while ensuring efficient chip unit heating.
Implementation Method 1
an electric heating element mounted in between the heat transfer layer and the thermally conductive base member around the flat bottom block for heating the chip unit
Implementation Method 2
a heat transfer layer set between the thermally conductive base member and the chip unit around the flat bottom block
Implementation Method 3
a thermal insulation component set between the electric heating element and the thermally conductive base member around the flat bottom block
Implementation Method 4
a heat sink having a flat bottom block protruded from a thermally conductive base member thereof and kept in close contact with the chip unit
Data Source
AI summary
A heating element and circuit module stack structure includes a circuit module carrying a chip unit, a heat sink having a flat bottom block protruded from a thermally conductive base member and in contact with the chip unit, a heat transfer layer set between the thermally conductive base member and the chip unit around the flat bottom block, an electric heating element mounted in between the heat transfer layer and the thermally conductive base member around the flat bottom block for heating the chip unit, and a thermal insulation component isolating the thermally conductive base member from the electric heating element. The circuit module turns on the electrical heating element when the temperature of the chip unit drops blow 0° C., and turns off the electrical heating element when the temperature reaches the normal operating temperature range, enabling the computer to be used in a low temperature or cold outdoor environment.