Heating Element Heat Transfer to Cooling Duct with Flexible Interface

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Solution Overview

Problem

Existing cooling structures using liquid heat dissipation members like grease or gap fillers suffer from leakage, adhesion issues, and poor disassembly workability, which degrade performance and increase maintenance complexity in electronic devices.

Innovation Solution

An electronic device design featuring a flexible member between the circuit board and heat dissipation filler, with a positioning unit to prevent direct contact and ensure thermal conductivity, allowing easy disassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If grease is used as the liquid heat dissipation member, then heat reduction properties are improved, but leakage and adhesion to gloves or work clothes occur

Engineering Contradiction:

Improveheat reduction propertiesVSAvoidleakage and adhesion

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

A flexible member is introduced as an intermediary between the heat dissipation filler and the cooling duct. This flexible member acts as a mediator that prevents direct contact between the heat dissipation filler and the cooling duct, thereby preventing adhesion while still allowing heat transfer through thermal conduction.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The flexible member is implemented as a thin film or sheet that can conform to the surfaces it contacts. This flexible structure allows for effective thermal contact with the heating element while preventing the heat dissipation filler from adhering to the cooling duct, solving both the heat transfer and adhesion problems.

Inventive Principle:

Principle #30Flexible shells and thin films

2Object-affected harmful factors

If heat dissipation gap filler is used instead of grease, then adhesion to gloves or work clothes is prevented, but adhesive force to the predetermined portion becomes extremely strong making disassembly difficult

Engineering Contradiction:

Improveadhesion to gloves or work clothesVSAvoiddisassembly workability

Core Design Contradiction:

Object-affected harmful factorsVSEase of repair

Solution Approach 1:

The flexible member serves as an intermediary layer between the heat dissipation filler and the cooling duct. This intermediary prevents the heat dissipation filler from directly adhering to the cooling duct, enabling easy separation and disassembly while maintaining effective heat transfer during operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat dissipation structure is segmented into distinct functional layers: the heat dissipation filler layer and the flexible member layer. This segmentation allows the heat dissipation filler to maintain its adhesive properties for heat transfer while the flexible member provides a non-adhesive interface for easy disassembly.

Inventive Principle:

Principle #1Segmentation

3Temperature

If heat dissipation filler is applied directly to the cooling duct, then thermal conductivity is improved, but disassembly workability is deteriorated due to strong adhesive force

Engineering Contradiction:

Improvethermal conductivityVSAvoiddisassembly workability

Core Design Contradiction:

TemperatureVSEase of repair

Solution Approach 1:

The flexible member is positioned as an intermediary between the heat dissipation filler and the cooling duct. This intermediary structure allows the heat dissipation filler to maintain optimal thermal contact with the heating element while preventing permanent adhesion to the cooling duct, thus enabling easy disassembly for repair and maintenance.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures effective thermal conductivity while facilitating easy disassembly and maintenance by preventing adhesion between the heating element and heat dissipation filler, enhancing repairability and reducing maintenance challenges.

Implementation Method 1

a heat dissipation filler provided in contact with a surface of the cooling duct facing the circuit board and having thermal conductivity for transferring heat from the heating element to the cooling duct

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a cooling duct disposed to face the circuit board and through which air for cooling the heating element passes

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250280489A1Electronic device for transferring heat from heating element to cooling duct

Publication Date: 2025.09.04 CANON KK

AI summary

An electronic device being excellent in disassembly workability at the time of repair or the like while sufficiently ensuring thermal conductivity for transferring heat from a heating element to a cooling duct. A circuit board has at least one heating element that generates heat by energization, a cooling duct is disposed to face the circuit board and through which air for cooling the heating element passes, a heat dissipation filler is provided in contact with a surface of the cooling duct facing the circuit board and having thermal conductivity for transferring heat from the heating element to the cooling duct, a flexible member is provided between the circuit board and the heat dissipation filler and having flexibility, and a positioning unit which positions the flexible member at a position where contact between the circuit board and the heat dissipation filler can be prevented.