Heating Element Layout for Stable Heat Dissipation in Power Modules
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Solution Overview
Problem
Existing methods struggle to maintain heat dissipation performance in semiconductor devices when the configuration of thermally conductive members is changed, making it difficult to determine the benefits of such changes.
Innovation Solution
A program and device that calculate and propose a new heating element configuration by comparing reference and comparative models, adjusting dimensions and materials to maintain equivalent heat dissipation performance while reducing costs, using a thermal resistance equation to fit and calculate optimal heating area and element dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the size of the power module is reduced to lower costs, then the cost is reduced, but the heat density increases and heat dissipation performance deteriorates
Solution Approach 1:
The invention changes the physical parameters of the thermally conductive member, specifically its thickness and thermal conductivity, to optimize heat dissipation in reduced-size power modules. By adjusting these parameters, the system maintains adequate heat dissipation performance while achieving cost reduction through miniaturization.
2Ease of manufacture
If the size of the heating element is reduced to lower costs, then the cost is reduced, but the heat dissipation performance deteriorates
Solution Approach 1:
The invention compensates for the reduced heating element size by changing parameters of the thermally conductive member, specifically increasing its thermal conductivity or optimizing its thickness. This parameter adjustment ensures that heat dissipation performance is maintained even when the heating element size is reduced for cost purposes.
3Ease of manufacture
If the configuration of the thermally conductive member is changed to reduce costs, then the cost is reduced, but the heat dissipation performance becomes unpredictable
Solution Approach 1:
The invention uses thermal resistance calculation as a feedback mechanism to evaluate and optimize the configuration of the thermally conductive member. By calculating thermal resistance based on the configuration parameters (thickness, thermal conductivity, area), the system can predict heat dissipation performance and adjust the configuration to maintain reliability while reducing costs.
Solution Approach 2:
The invention systematically changes parameters of the thermally conductive member (thickness, thermal conductivity, area) and uses thermal resistance calculation to predict the resulting heat dissipation performance. This allows for optimized configuration that reduces cost while maintaining reliable heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the proposal of a heating element configuration that maintains heat dissipation performance when the thermally conductive member configuration is altered, reducing the size of heating elements and lowering costs, with improved efficiency in generating proposed configurations.
Implementation Method 1
a heating element 1100
Implementation Method 2
a multi-layered thermally conductive member 1200
Data Source
AI summary
A heating element configuration that can maintain heat dissipation performance when a configuration of a thermally conductive member is changed is proposed. A proposal device includes a reference performance calculation unit that calculates heat dissipation performance based on a reference model representing a configuration of a semiconductor device with a multi-layered thermally conductive member includes a heating element; a comparative performance calculation unit that calculates heat dissipation performance based on a comparative model in which a configuration of the thermally conductive member of the reference model is changed; a proposed configuration generation unit that generates a proposed model in which a configuration of the heating element of the comparative model is changed such that the heat dissipation performance based on the comparative model is equivalent to the heat dissipation performance based on the reference model; and a result output unit that outputs information based on the proposed model.