Heating Element with Microwave Transmission Holes for Uniform Substrate Processing
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Solution Overview
Problem
Conventional semiconductor manufacturing processes face challenges in uniformly heating substrates with high-density patterns, leading to non-uniform processing of thin films and crystal structures.
Innovation Solution
A substrate processing apparatus utilizing a heating element with electromagnetic wave transmission and non-transmission regions, where microwave transmission holes in heat equalizing plates allow for simultaneous direct and indirect heating, ensuring uniform temperature distribution across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating methods are used, then heating speed can be maintained, but temperature uniformity across the substrate deteriorates
Solution Approach 1:
The heating element is segmented into multiple independent heating zones along the substrate processing direction. Each heating zone can be independently controlled to provide differentiated heating, ensuring uniform temperature distribution across the entire substrate while maintaining efficient heating speed through coordinated operation of multiple zones.
Solution Approach 2:
Different regions of the heating element are designed with locally optimized heating characteristics. The heating power density varies across different zones to compensate for heat loss patterns and substrate geometry, providing enhanced temperature uniformity without sacrificing overall heating efficiency.
2Productivity
If heating power is increased to improve processing speed, then productivity increases, but temperature distribution uniformity deteriorates
Solution Approach 1:
The heating element incorporates dynamic control capabilities where heating power in different zones can be adjusted in real-time based on feedback from temperature sensors. This dynamic adjustment allows the system to maintain optimal processing speed while continuously correcting temperature distribution to achieve uniformity across the substrate.
Solution Approach 2:
Temperature sensors are positioned to monitor the temperature distribution across the substrate, and this feedback information is used to adjust the heating power of different heating zones. This closed-loop control ensures that processing speed requirements are met while maintaining uniform temperature distribution through real-time compensation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables uniform heating of substrates, maintaining high-speed and selective heating capabilities while improving in-plane temperature uniformity and reducing processing costs.
Implementation Method 1
a heating element which is made of a material heated by absorbing an electromagnetic wave supplied from a heating device
Implementation Method 2
an electromagnetic wave transmission region which transmits the electromagnetic wave
Data Source
AI summary
A heating element which is made of a material heated by absorbing an electromagnetic wave supplied from a heating device and which has an electromagnetic wave transmission region which transmits the electromagnetic wave and an electromagnetic wave non-transmission region which does not transmit the electromagnetic wave.