Heating Film Hole Layout for Stable High-Porosity Atomization
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Solution Overview
Problem
Existing heating assemblies in electronic atomization devices face stability issues due to increased hole density leading to higher resistance and failure rates, as conventional methods to enhance porosity reduce spacing between holes, causing excessive heat flux and potential cracking or burnout.
Innovation Solution
A heating assembly design with liquid guiding holes arranged at higher density in one direction and equal or reduced density in a perpendicular direction maintains consistent cross-sectional area, ensuring stable current flow and preventing overheating by maintaining resistance while increasing porosity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the density of through holes is increased to improve porosity, then the porosity of the heating assembly is improved, but the spacing between holes is reduced, increasing the resistance of the heating film and reducing stability
Solution Approach 1:
The patent applies asymmetry by arranging liquid guiding holes with different densities in different directions. Specifically, the spacing between adjacent holes in the first direction (parallel to current flow) is different from the spacing in the second direction (perpendicular to current flow). This asymmetric arrangement allows increased porosity while maintaining adequate spacing to prevent excessive resistance and heating film failure.
Solution Approach 2:
The patent applies local quality by creating directionally-dependent hole distribution. The heating assembly has non-uniform hole density tailored to different spatial directions - higher density in one direction and lower density in the perpendicular direction. This localized variation optimizes both porosity and electrical stability by ensuring adequate current path spacing while maintaining high liquid guidance capacity.
2Quantity of substance
If the spacing between holes is reduced to increase hole density, then the porosity is improved, but the resistance of the heating film increases and failures occur during operation
Solution Approach 1:
The patent resolves this contradiction by implementing asymmetric hole spacing where the distance between adjacent holes in the first direction (parallel to current flow) is maintained at a larger value compared to the spacing in the second direction. This asymmetric configuration allows high overall hole density while preserving sufficient spacing along current paths to prevent excessive resistance and thermal failures.
Solution Approach 2:
The patent applies local quality by optimizing hole spacing differently in different spatial directions. Regions where current flows have larger hole spacing to maintain electrical stability, while perpendicular regions have smaller spacing to maximize porosity. This directionally-specific optimization eliminates the harmful effects of uniform high-density hole arrangements.
3Quantity of substance
If the hole density is increased uniformly in all directions, then the porosity is improved, but the cross-sectional area for current flow is reduced, causing excessive heat flux and potential cracking or burnout
Solution Approach 1:
The patent applies asymmetry by creating directionally-dependent hole spacing that is larger in the direction parallel to current flow (first direction) and smaller in the perpendicular direction (second direction). This asymmetric arrangement maintains adequate cross-sectional area for current flow to prevent excessive heat flux, while still achieving high porosity through increased density in the perpendicular direction.
Solution Approach 2:
The patent applies local quality by tailoring hole spacing to the local thermal and electrical requirements. Areas where current flows have reduced hole density to maintain thermal stability and prevent burnout, while areas perpendicular to current flow have increased hole density to maximize porosity. This localized optimization resolves the contradiction between porosity and thermal stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design enhances the stability and porosity of the heating film, preventing cracking and burnout, while maintaining consistent resistance and efficient atomization performance.
Implementation Method 1
The relatively common atomization method for existing heating assemblies is resistance heating
Implementation Method 2
The substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface
Data Source
Figure 1~2
Figure 3~5a
Figure 5b~6a
AI summary
This application discloses a heating assembly, an atomizer, and an electronic atomization device, where the heating assembly includes a substrate and a heating film. The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed, the substrate is provided with a plurality of liquid guiding holes that run through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface, the liquid guiding holes extend to the heating film and run through the heating film. A current flow direction in the heating film is defined as a first direction, a direction perpendicular to the current flow direction in the heating film is defined as a second direction, and the arrangement density of the plurality of liquid guiding holes in the first direction is greater than the arrangement density of the plurality of liquid guiding holes in the second direction, thereby ensuring the stability of the heating film while increasing the porosity of the substrate.