Heating Lamp Base Recesses for Air Flow Control and Grip
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heating lamps in semiconductor process chambers experience filament depletion due to material deposition on inner surfaces caused by cooling air flow, and have smooth bases that provide inadequate grip for safe installation and removal, leading to potential injury and filament failure.
Innovation Solution
The design includes a heating lamp with a base that limits air flow between adjacent lamps to maintain higher temperatures, preventing material deposition and featuring recesses for improved user grip, along with fins to further reduce air flow and enhance handling safety.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional heating lamps are used with smooth bases, then manufacturing is simple, but user grip is inadequate causing safety injuries
Solution Approach 1:
The base incorporates curved recesses instead of flat smooth surfaces. These recesses create contoured gripping areas that conform to the shape of fingers, providing mechanical advantage and secure hold during installation and removal operations.
2Temperature
If high air flow is allowed about the heating lamp, then cooling of components occurs, but material deposits on inner surfaces causing filament depletion
Solution Approach 1:
The recesses in the base are positioned to intercept and redirect cooling air flow away from the heating lamp envelope. What would otherwise be harmful cooling air flow is converted into a controlled flow pattern that maintains higher temperatures on the envelope, preventing material deposition while still allowing some cooling function.
3Reliability
If recesses are added to the base for improved grip, then user safety is enhanced, but manufacturing complexity increases
Solution Approach 1:
The recesses are designed with specific dimensional parameters (depth, width, curvature radius) that optimize grip while being compatible with standard manufacturing processes. The geometry is simplified to allow formation through common techniques such as CNC machining or molding, balancing safety performance with manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution extends the useful life of the heating lamp by reducing filament depletion and enhances user safety during installation and removal by providing a secure grip, reducing the risk of injury.
Implementation Method 1
conventional heating lamps utilized in semiconductor process chambers typically have a profile that allows high air flow about the heating lamp
Implementation Method 2
heating lamps having a filament fabricated from a material such as tungsten (W)
Implementation Method 3
the filament material may sublime and deposit on inner surfaces of the heating lamp
Data Source
AI summary
Embodiments of heating lamps and heating lamp arrays are disclosed herein. In some embodiments, a heating lamp may include a heating lamp envelope having a filament disposed within the heating lamp envelope; a base coupled to the heating lamp envelope to support the heating lamp envelope; and one or more recesses formed in the base to provide an improved grip for a user. In some embodiments, a heating lamp array for use in a semiconductor process chamber may include a plurality of heating lamps, each heating lamp comprising a heating lamp envelope having a filament disposed within the envelope and a base coupled to the heating lamp envelope to support the envelope, the base having one or more recesses formed in the base to provide an improved grip for a user, wherein a distance between adjacent heating lamp bases is about 0.02 inches to about 0.08 inches.