Heating Member PCB Electrical Connection for Substrate Temperature Control
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Solution Overview
Problem
Existing heating members for substrates in semiconductor processes face limitations in dividing heating zones due to increased electric wire volume, leading to temperature imbalances and stress on joints, as well as inefficiencies in air convection and heat conduction.
Innovation Solution
A heating member comprising a heater plate with bonded heating elements, a connecting plate with via holes for electrical connection, and a control plate for precise temperature control, eliminating the need for electric wires under the heating member to enhance zone division, convection uniformity, and reduce joint stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of electric wires is increased to divide heating zones, then the heating zone division capability is improved, but the entire volume of electric wires increases and device complexity increases
Solution Approach 1:
The patent replaces the mechanical electric wire system with a printed circuit board (PCB)-based electrical connection system. Circuit patterns are formed on the PCB to connect heating elements, eliminating the need for separate electric wires and joints. This substitution reduces the overall volume of conductive materials while maintaining the ability to divide and control multiple heating zones independently.
Solution Approach 2:
The patent merges the functions of electric wire connections and circuit board functionality into a single integrated PCB structure. The PCB serves both as the structural support and as the electrical connection medium, with circuit patterns directly formed on its surface. This integration eliminates the need for separate wire connections and reduces device complexity.
2Reliability
If electric wires are joined to heating wires, then electrical connection is achieved, but losses according to lower air convection types differ and temperature difference between regions occurs
Solution Approach 1:
The patent uses a uniform PCB substrate with consistently formed circuit patterns to ensure homogeneous thermal and electrical properties across the heating element assembly. The PCB provides a uniform mounting surface and consistent thermal conduction path, eliminating the variable air convection losses that occur with differently shaped electric wires. This homogeneity ensures uniform temperature distribution across different heating zones.
3Adaptability or versatility
If electric wires are joined with curvatures, then flexibility is achieved, but stress is applied to joints and strong stress may cause damage
Solution Approach 1:
The patent replaces the flexible but stress-prone electric wire system with a rigid PCB-based system. The PCB provides structural support and electrical connection without requiring flexible joints. Circuit patterns are formed directly on the PCB surface, eliminating the need for wire bending and joint creation, thereby preventing stress concentration and joint failure.
4Reliability
If electric wires are joined to heating elements, then electrical connection is achieved, but heat loss depending on conduction occurs and temperature imbalance is caused
Solution Approach 1:
The patent replaces point-contact wire connections with distributed circuit pattern connections on the PCB. The circuit patterns provide multiple parallel conduction paths for both electrical current and thermal energy, reducing the thermal resistance and minimizing heat loss at connection points. This distributed connection system maintains better thermal coupling between the heating elements and the PCB, reducing temperature imbalance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for precise temperature control, increased heating zones, uniform air convection, and reduced temperature differences between regions, improving the efficiency and reliability of substrate heating processes.
Implementation Method 1
a heater plate having at least one heating element bonded thereto
Implementation Method 2
making air convection under the heating member uniform, reducing a difference in temperature between regions
Data Source
AI summary
The inventive concept relates to a heating member for heating a substrate. In an embodiment, the heating member includes a heater plate having at least one heating element bonded thereto, a connecting plate having a first space formed therein in which the heating element is accommodated, and a control plate having a control element bonded thereto, the control element being electrically connected with the heating element to control the heating element.