Heating Plate Bonding Structure for Thermal Expansion Stress
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Solution Overview
Problem
The existing heating plates used in semiconductor and flat display panel manufacturing experience interfacial stress due to thermal expansion of materials with different coefficients, leading to broken bonded surfaces and increased manufacturing time due to separate terminal connection processes.
Innovation Solution
A heating plate design featuring a base layer with a bonding force reducing body, such as a lattice of particle bodies with hollow regions and a coating layer, to reduce interfacial stress and a single bonding process for the terminal stand, using a sintering method to combine layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the heating wire layer and base layer are bonded directly, then the bonding strength is high, but interfacial stress causes the bonded surface to break during thermal expansion
Solution Approach 1:
A terminal connection layer is introduced as an intermediary between the heating wire layer and the base layer. This intermediate layer acts as a stress buffer during thermal expansion, preventing direct stress transmission that would cause bonded surface breakage, while still maintaining adequate bonding strength through controlled bonding processes.
Solution Approach 2:
The bonding characteristics are modified by changing the bonding parameters - using bonding conditions that create a controlled bond strength rather than maximum strength. This allows the interface to accommodate thermal expansion stresses while maintaining functional bonding, resolving the contradiction between strong bonding and stress resistance.
2Strength
If a separate terminal connection layer is formed, then the coupling force of terminal stand is increased, but manufacturing time is increased
Solution Approach 1:
The terminal connection layer formation and terminal stand coupling are merged into a single integrated process step. The terminal connection layer is formed and the terminal stand is coupled in one continuous operation, eliminating separate manufacturing steps while maintaining the necessary coupling force through proper process design.
Solution Approach 2:
The terminal connection layer is prepared in advance with appropriate material properties and surface characteristics that enable direct coupling of the terminal stand. This preliminary preparation allows the coupling operation to be performed efficiently in one step without requiring additional intermediate processes.
3Ease of manufacture
If soldering bonding is used to combine heating wire layer and terminal connection layer, then bonding is achieved, but the soldered bonding portion is easily melted during heating
Solution Approach 1:
The bonding method parameters are changed by selecting materials and processes with higher temperature resistance. Instead of conventional soldering with low melting point materials, the process uses high-temperature resistant bonding materials and methods that can withstand the heating temperatures without melting or degrading.
Solution Approach 2:
Composite bonding structures are employed that combine materials with complementary properties - one layer provides easy bonding processability while another layer provides high-temperature resistance. This composite approach allows the bonded joint to be easily formed yet resistant to thermal damage during operation.
4Reliability
If brazing bonding is used to combine heating wire layer and terminal connection layer, then high temperature resistance is achieved, but the brazing area is melted or carbonized
Solution Approach 1:
Different regions of the bonding structure have different material properties optimized for their specific functions. The terminal connection layer uses materials with high temperature resistance for structural integrity, while the bonding interface uses materials and processes that avoid melting and carbonization. This localized optimization allows high temperature resistance without the harmful effects of brazing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents bonded surface breakage during thermal expansion and reduces manufacturing time by dispersing stress and allowing a single bonding process for the terminal stand.
Implementation Method 1
the heating wire layer and the base layer are made of different materials, the heating wire layer and the base layer expand in different volumes during thermal expansion, resulting in interfacial stress at the bonded surface
Implementation Method 2
using a sintering method to combine layers
Data Source
AI summary
Disclosed is a heating plate for supporting and heating a substrate, the heating plate including: a base layer on which a substrate is seated; a bonding layer bonded to a lower surface of the base layer, and a bonding force reducing body disposed between the base layer and the bonding layer to reduce interfacial bonding force between the bonding layer and the base layer.