Heating Plate Support Structure for Low-Heat-Loss Aerosol Heating

The patent introduces an intermediary insulating body positioned between the heating plate and the supporting structure. This insulating body acts as a thermal mediator that mechanically transmits the heating plate's weight to the support while blocking thermal conduction paths, thereby maintaining positioning accuracy without sacrificing energy efficiency.

The patent extracts the thermal conduction function from the supporting structure by introducing a separate insulating component. The supporting structure retains only its mechanical support and positioning functions, while the insulating body assumes the thermal isolation function, preventing heat dissipation to the support structure.

The insulating body serves as a thermal intermediary that decouples the thermal and mechanical functions. It provides sufficient mechanical support for structural stability while its low thermal conductivity properties prevent heat transfer, thereby maintaining both stability and thermal efficiency.

The supporting system becomes a composite structure combining the heating plate, insulating body, and supporting structure. This composite arrangement leverages the high thermal conductivity of the heating plate for efficient heat transfer to the substrate while using the low thermal conductivity of the insulating body to prevent parasitic heat loss to the support structure.

The insulating body is designed as a simple intermediary component that integrates seamlessly into the existing supporting structure. Its straightforward geometry and placement minimize design complexity while effectively reducing heat loss, avoiding the need for complex insulation systems.

Instead of insulating the entire device, the patent applies insulation locally only at the critical heat loss path between the heating plate and the supporting structure. This targeted approach reduces heat loss effectively while minimizing the addition of components and overall device complexity.