Heating Plate Power Terminal Bonding With Magnetic Thermal Compression
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Solution Overview
Problem
The existing bonding methods for power terminals of heating units in semiconductor manufacturing face issues with void growth and intermetallic compound formation due to insufficient solder melting point margins, leading to reduced mechanical and electrical performance and long-term reliability.
Innovation Solution
A bonding method and apparatus that involves forming a metal paste between the heating wire and power terminal, applying thermal compression with a pressing jig, and controlling temperature through multiple stages to ensure reliable bonding, using a magnetic holder and elastic support for the power terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a reflow process is used for bonding the power terminal, then the bonding process is simple and efficient, but solder degradation occurs due to high temperature exposure leading to void growth and intermetallic compound formation
Solution Approach 1:
The patent changes the bonding parameters by using thermal compression bonding at controlled temperatures (first treatment at 70-90°C, second treatment at 290-310°C) instead of the conventional reflow process. This parameter change prevents solder degradation while achieving reliable bonding, resolving the contradiction between process efficiency and bonding reliability.
Solution Approach 2:
The patent replaces the thermal-mechanical reflow process with a thermal compression bonding process that uses a pressing jig to apply mechanical pressure during controlled heating. This substitution allows for better control of bonding conditions, preventing void growth and intermetallic compound formation while maintaining bonding effectiveness.
2Temperature
If the power terminal is exposed to high temperatures for long periods, then the heating function is effective, but solder degradation accelerates causing void growth and intermetallic compound formation
Solution Approach 1:
The patent applies preliminary thermal compression bonding treatment to the power terminal before it undergoes prolonged high-temperature operation. The two-stage bonding process (first at 70-90°C, second at 290-310°C) prepares the solder joint in advance, creating a robust bond that resists degradation during subsequent high-temperature exposure, thus preventing void growth and intermetallic compound formation.
Solution Approach 2:
The patent changes the bonding temperature parameters from the conventional high-temperature reflow process to a two-stage process with controlled temperature ranges (70-90°C followed by 290-310°C). This parameter optimization allows effective bonding while minimizing thermal stress on the solder, preventing degradation even during prolonged high-temperature operation.
3Ease of manufacture
If conventional bonding methods are used, then the process is straightforward, but voids grow in deteriorated environments reducing mechanical and electrical performance
Solution Approach 1:
The patent replaces the conventional reflow bonding method with a thermal compression bonding process that uses a pressing jig to apply controlled mechanical pressure during heating. This mechanical control during bonding prevents void formation from the outset, maintaining both manufacturing simplicity and superior mechanical/electrical performance even in deteriorated environments.
Solution Approach 2:
The patent introduces a pressing jig as an intermediary tool that applies controlled pressure during the bonding process. This intermediary mechanism ensures uniform pressure distribution and prevents void formation, improving mechanical and electrical performance while keeping the manufacturing process straightforward through automated implementation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents solder oxidation, extends the solder's life cycle, and prevents short circuits by ensuring uniform pressure distribution and high-temperature durability through controlled thermal treatments.
Implementation Method 1
the power terminal may be attached to a magnetic holder having a magnetic force provided on an upper plate of the pressing jig
Implementation Method 2
a bonding step of sintering the object to be bonded by thermal compression
Implementation Method 3
after performing a first treatment at a first set temperature, a second treatment may be performed at a second set temperature different from the first set temperature
Implementation Method 4
the magnetic holder may provide a pressing force to the power terminal while being elastically supported by an elastic body on the upper plate of the pressing jig
Data Source
AI summary
The present invention relates to a bonding apparatus for a power terminal of a heating plate, for bonding the power terminal supplying power to a heating wire of a substrate. The bonding apparatus for a power terminal of a heating plate comprises: a chamber; a stage which is disposed in an inner space of the chamber and on which the substrate is placed; an upper press portion disposed in the inner space of the chamber to face the stage, provided to be vertically movable, and having a terminal fixing portion configured to fix the power terminal; and an elevating driver configured to move the upper press portion up and down, wherein the terminal fixing portion further includes a magnetic holder configured to hold the power terminal by a magnetic force.