Heating System Component for Sensing a First and Second Temperature
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Solution Overview
Problem
Existing heating system components face challenges in monitoring the temperature of both the heating unit and the medium efficiently due to bulky temperature sensors, which limits flexibility and accuracy in temperature measurement.
Innovation Solution
A compact heating system component design featuring a heat conducting plate assembly with separate heat capturing and releasing plate portions, thermally coupled to both the heating unit and medium, and integrated with a printed circuit board for precise temperature sensing, allowing for flexible installation and improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bulky temperature sensors are used to monitor temperature, then temperature monitoring function is achieved, but flexibility in positioning and coupling is reduced
Solution Approach 1:
The temperature sensor is divided into two separate sensing areas (first sensor area and second sensor area) that can independently sense different temperatures. This segmentation allows each sensor area to be positioned optimally for its specific measurement task, improving flexibility while maintaining reliable temperature monitoring of both the heating unit and the medium.
Solution Approach 2:
The patent transitions from using a single bulky temperature sensor to a planar printed circuit board with distributed sensor areas. This dimensional change from three-dimensional bulky sensors to a two-dimensional flat structure enables flexible positioning and coupling while achieving reliable temperature monitoring at multiple locations.
2Reliability
If both medium temperature and heating unit temperature are monitored separately, then comprehensive temperature monitoring is achieved, but device complexity increases
Solution Approach 1:
The patent merges both temperature sensing functions (medium temperature sensing and heating unit temperature sensing) into a single integrated printed circuit board. The first sensor area and second sensor area are both implemented on the same PCB, which simplifies the overall device structure while enabling comprehensive temperature monitoring of both the medium and the heating unit.
Solution Approach 2:
The printed circuit board serves multiple functions: it provides the first sensor area for monitoring medium temperature and the second sensor area for monitoring heating unit temperature. This multi-functional design achieves comprehensive temperature monitoring without increasing device complexity, as a single component (the PCB) performs both sensing tasks.
3Adaptability or versatility
If a compact design with integrated housing is used, then installation flexibility is improved, but thermal interference between sensor areas may occur
Solution Approach 1:
The patent applies local quality by providing thermal isolation specifically at the critical interface between the first sensor area and second sensor area. The housing includes thermal isolation structures (such as thermal breaks or insulating materials) positioned locally where the sensor areas are thermally coupled to different components. This localized thermal isolation prevents heat from the heating unit from interfering with the medium temperature measurement, while still allowing the compact integrated design to maintain installation flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances flexibility and accuracy in temperature measurement by allowing simultaneous monitoring of two temperatures within a single housing, reducing thermal interference and improving the compactness and reliability of the heating system.
Implementation Method 1
a first heat capturing plate portion (54) that is thermally coupled to the heating unit (28), a second heat capturing plate portion (56) that is thermally coupled to the medium leading section (42)
Implementation Method 2
a second heat capturing plate portion (56) that is thermally coupled to the medium leading section (42)
Implementation Method 3
at least one printed circuit board (48) comprising circuitry with a first sensor area (72) and a second sensor area (74), wherein the circuitry is configured to sense a first temperature at the first sensor area (72) and a second temperature at the second sensor area (74)
Implementation Method 4
the circuitry is configured to sense a first temperature at the first sensor area (72) and a second temperature at the second sensor area (74)
Data Source
AI summary
The present invention relates to a heating system component, including a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side; a heating unit at least partially received in the groove; a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion; at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area; a housing accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in such a way that the first sensor area is thermally coupled to the first heat releasing plate portion and the second sensor area is thermally coupled to the second heat releasing plate portion.