Heating System Temperature Correction for Film Accumulation
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Solution Overview
Problem
Existing heating systems for semiconductor wafers face challenges in maintaining uniform processing temperature due to the accumulation of extraneous matter, which affects film thickness uniformity and requires experienced operators for temperature control.
Innovation Solution
A heating system with a processing chamber, heating condition storage, and an optimized value calculating mechanism that adjusts the heating temperature based on accumulated film thickness, using a temperature correcting table or model to maintain precise temperature control without operator expertise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If temperature control is performed based on accumulated film thickness relationships, then uniformity between batches is improved, but operator expertise and manual adjustment are still required
Solution Approach 1:
The heating system automatically determines the accumulated film thickness based on the number of heating processes and autonomously calculates and applies temperature corrections using stored correction values, eliminating the need for operator intervention or expertise in temperature control adjustments
Solution Approach 2:
The system incorporates a feedback mechanism where the number of heating processes is continuously tracked, and this information is used to automatically retrieve appropriate temperature correction values and adjust the heating temperature to maintain consistency despite film accumulation
2Temperature
If five zones are provided in the heating furnace for temperature control, then temperature distribution is improved, but device complexity increases
Solution Approach 1:
The system applies local quality by storing and applying specific temperature correction values for different zones within the heating furnace, allowing each zone to be independently adjusted based on its specific thermal characteristics and film accumulation patterns
3Adaptability or versatility
If manual temperature adjustment by experience is used, then flexibility is maintained, but manufacturing precision deteriorates
Solution Approach 1:
The system systematically changes the temperature parameter based on the number of heating processes and accumulated film thickness, using pre-determined correction values to automatically adjust the heating temperature, thereby maintaining both flexibility and precision without relying on operator experience
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and precise control of processing temperature, ensuring uniform film thickness and quality across batches, even for operators without experience, by calculating and applying optimized temperature adjustments.
Implementation Method 1
a heating means having a processing chamber adapted for containing an object to be processed therein, the heating means being adapted for heating the object to be processed in the processing chamber
Implementation Method 2
a temperature correcting table storage means adapted for storing therein a temperature correcting table indicative of a relationship between the heating temperature, an accumulated film thickness of extraneous matter associated with the heating process and attached to the interior of the apparatus, and a temperature correcting value for correcting a temperature error in the processing chamber attributable to the attachment of the extraneous matter
Data Source
AI summary
The present invention provides a heating system, a heating method and a program, which can readily control processing temperature. A temperature calculating computer 4 of the heating system includes a device DB 42. The device DB 42 stores therein a temperature correcting table indicative of a relationship between an accumulated film thickness of extraneous matter attached to the interior of each heating apparatus and a temperature correcting amount, with respect to each heating apparatus, for each temperature (processing temperature) in the heating apparatus. Thus, the temperature correcting amount can be specified based on the temperature correcting table, the processing temperature and the accumulated film thickness, so that an optimized value can be calculated from the specified temperature correcting amount.