Heating Unit Casing Layout for Electronic Component Heat Dissipation

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Solution Overview

Problem

In conventional heat medium heating devices, heat-generating electronic components are not effectively cooled, leading to overheating and potential failure.

Innovation Solution

A heating device design that includes a circuit board with electronic components, a casing with a storage space and a flow path for a heat medium, and a heater. The design features a contact wall portion within the storage space that directly or indirectly contacts the electronic components and exposes them to outside air for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If electronic components are placed in a closed board storage portion, then the device structure is compact and simple, but heat dissipation is insufficient causing overheating

Engineering Contradiction:

Improveelectronic component temperatureVSAvoidelectronic component normal operation

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The board storage portion is divided into a first board storage portion and a second board storage portion, with the second portion having an opening that communicates with the external environment. This segmentation allows different thermal management strategies for different components while maintaining overall structural compactness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A heat dissipation member is extracted and placed in the opening of the second board storage portion. This member specifically targets the heat dissipation need of heat-generating electronic components by providing a dedicated thermal management structure that extends to the external environment.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 3:

The heat dissipation member acts as an intermediary between the heat-generating electronic components and the external environment. It facilitates heat transfer from the components through the opening to the outside air, enabling effective thermal management without compromising the compact enclosed structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If heat-generating electronic components are placed in the board storage portion, then the device integrates heating and control functions, but heat accumulates causing components to overheat and fail

Engineering Contradiction:

Improveintegrated heating and control functionsVSAvoidheat accumulation

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

Different regions of the board storage portion are given different thermal characteristics. The first board storage portion maintains a closed structure for general component protection, while the second board storage portion features an opening for heat dissipation. Heat-generating components are specifically positioned in the second portion to utilize the opening for thermal management.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The heat generated by electronic components, which is normally a harmful factor causing overheating, is converted into a beneficial resource by using it to preheat the heat medium flowing through the flow path. The heat dissipation member facilitates this heat transfer, turning waste heat into useful thermal energy for the heating function.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The enhanced heat dissipation design effectively transfers heat from the electronic components to outside air, preventing overheating and ensuring the components function normally.

Implementation Method 1

a heater (11) which is provided in the flow path (21) and heats the heat medium

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a contact wall portion (26) with which the electronic component (13) directly or indirectly contacts

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the contact wall portion (26) contacts with outside air

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250081294A1Heating device

Publication Date: 2025.03.06 NITERRA CO LTD

AI summary

A heating device 10 including: a circuit board 12; an electronic component 13 provided on the circuit board 12; a casing 20 having formed therein a storage space 29 in which the circuit board 12 is stored and a flow path 21 through which a heat medium flows; and a heater 11 which is provided in the flow path 21 and heats the heat medium, wherein a plurality of wall portions forming the storage space 29 include a contact wall portion 26 with which the electronic component 13 indirectly contacts, and the contact wall portion 26 contacts with outside air.